Mallik, Sabuj, Schmidt, M., Bauer, R. and Ekere, Ndy (2008) Influence of solder paste components on rheological behaviour. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, USA, pp. 1135-1140. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684512)

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Abstract

Rheological properties of solder pastes are very important for a high quality surface mount technology process. The stencil/screen printing process of solder pastes is one of the most critical steps in the SMT assembly process, as most of the assembly defects can often be shown to originate from paste rheology and associated poor printing performance. This paper concerns an investigation of the effect of solder paste composition on the rheological properties and behaviour of four different solder pastes. We report on the evaluation of three different paste formulations based on the no-clean flux composition, with different alloy composition, metal content and particle size using a range of rheological characterisation techniques - including viscosity measurements, yield stress, oscillatory and creep-recovery tests. Our results show that in the viscosity test, all solder pastes exhibited a shear thinning behaviour in nature with different highest maximum viscosity. In the region of shear thinning behaviour the paste 3 delivered the best results. Viscosity test helps to understand the solid and cohesive behaviour of solder pastes. Good solid and cohesive behaviour indicates a good paste roll and helps to avoid paste bleeding. The yield stress test has been used to study the effect of temperature on the flow behaviour of solder pastes. Yield stress was measured for a range of temperature from 15deg C to 35deg C with an increment of 5degC. The result indicated a decreasing of the yield stress point if the temperature was increased. Paste 4 has shown the minimum dependence on temperature. The oscillatory test has been used to find out the linear visco-elastic range and to study the solid and liquid like behaviours of solder pastes. Paste 1 indicated the biggest linear visco-elastic region (LVR) and the highest value of G' and G" which means solder paste 1 will be needed a higher squeegee pressure in the printing process. In the creep recovery test paste 4 showed the best- - recovery and the lowest values of creep and recovery compliance which indicated a good printing behaviour. The test also has showed the solder paste with smaller particle size exhibit less recovery

Item Type:	Conference Proceedings
Title of Proceedings:	2008 2nd Electronics System-Integration Technology Conference
Additional Information:	This paper which forms part of the published proceedings was given at the 2008 2nd Electronic System-Integration Technology Conference (ESTC), held 1-4 Sep 2008, University of Greenwich, Greenwich, London, United Kingdom.
Uncontrolled Keywords:	cement-based materials, microstructure, attenuation, stress, solder pastes, rheology
Subjects:	T Technology > T Technology (General) T Technology > TS Manufactures T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Engineering School of Engineering > Department of Engineering Systems School of Engineering > Manufacturing Engineering Research Group
Related URLs:	Publisher Publisher Organisation Organisation
Last Modified:	27 Jan 2020 15:42
URI:	http://gala.gre.ac.uk/id/eprint/2669

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