Items where Author is "Zhu, X."
Article
Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S. H., Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. C.
(2014)
Electromigration in Sn-Ag solder thin films under high current density.
Thin Solid Films, 565.
pp. 193-201.
ISSN 0040-6090
(doi:10.1016/j.tsf.2014.06.030)
Conference Proceedings
Zhu, X., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879
(2014)
Modelling the stress effect during metal migration in electronic interconnects.
In: 14th IEEE International Conference on Nanotechnology.
IEEE, pp. 108-112.
ISSN 1944-9399
(doi:10.1109/NANO.2014.6968180)
Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C.
(2013)
Comments on electromigration analysis methods.
In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013).
Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534.
ISBN 9781479904983
(doi:10.1109/ICEPT.2013.6756527)
Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Zhu, X., Lu, H.
ORCID: https://orcid.org/0000-0002-4392-6562 and Yin, C.
ORCID: https://orcid.org/0000-0003-0298-0420
(2012)
Modelling metal migration for high reliability components when subjected to thermo-mechanical loading.
In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478.
ISBN 9781467345538
(doi:10.1109/EPTC.2012.6507130)