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Items where Author is "Zhu, X."

Items where Author is "Zhu, X."

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electro-migration Electromigration finite element method metal migration Modelling numerical modeling Solder material thermo-mechanical loading Thermomigration Thin film voids evolution
Number of items: 12.

electro-migration

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Zhu, X., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:10.1109/EPTC.2012.6507130)

Electromigration

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S. H., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:10.1109/ICEPT.2013.6756527)

finite element method

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:10.1109/ICEPT.2013.6756527)

metal migration

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Zhu, X., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:10.1109/EPTC.2012.6507130)

Modelling

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S. H., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

numerical modeling

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:10.1109/ICEPT.2013.6756527)

Solder material

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S. H., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

thermo-mechanical loading

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Zhu, X., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:10.1109/EPTC.2012.6507130)

Thermomigration

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S. H., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

Thin film

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S. H., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

voids evolution

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:10.1109/ICEPT.2013.6756527)

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