Items where Author is "Tilford, Tim"

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3D printing accelerated stress test accelerated testing additive manufacturing adhesive materials assembly assembly process technology bumps CFD chip mountdown solder chip-on-board (COB) assembly cognition convection oven cooling efficiency coupled simulation creep cure cure process curing curing processes cyclic thermal-mechanical loading damage deformation Design tools die attach dielectric losses dielectric materials electrical configurations electromagnetic heating electronic components electronic engineering electronic packaging electronic products Electronics packaging encapsulation end-fed probes engineering design failure modes failure modes and mechanisms fatigue failure FDTD finite element finite element analysis finite element analysis (FEA) flip-chip assembly flip-chip underfills frequency agile microwave oven bonding system (FAMOBS) genetic algorithm glob top heat sensitive film heat sink heat sink design heat transfer IGBT individual surface mount components information visualisation inkjet printing interaction design isolation substrate jet impingement cooling system level-set method low power tests low-loss dielectric machine learning manufacturing systems Maxwell's equations metamodels micro-electronics manufacture microelectronics microelectronics fabrication microelectronics packaging microsystems microwave microwave curing microwave devices microwave heating microwave oven microwave ovens microwave radiation microwave system microwave systems microwaves Miner's linear damage accumulation modeling Modelling moving meshes multi-physics multiphysics multiphysics modelling nanotechnology natural convection numerical analysis numerical modelling numerical simulations open-ended applicator open-ended microwave curing system open-ended microwave oven open-ended oven open-oven optimisation optimization opto-electronic assembly packaged modules packaging packaging technology physics of failure techniques polymer polymer curing polymer encapsulant polymer materials curing polymers potting cure power components power electronic module power electronic modules power electronics power electronics modules power electronics modules (PEMs) process efficiency reduced order models relative permittivity reliability reliability prediction reliability prediction techniques reliability testing residual stress RF-ID tag bonding risk mitigation rotation shape optimisation simulation solder interconnects solder joint failure solder joints stress and strain distribution structural bonding substrate delamination thawing thermal cycling reliability thermal diffusivity thermal fatigue thermal management thermal processing thermal-mechanical loading thermosetting polymer materials topological optimization topology optimization uncertainty analysis variable frequency microwave (VFM) Variable Frequency Microwave (VFM) heating variable frequency microwave technology viscoplastic behaviour visual impairment wafer processing wafer scale level packaging waveguide cavity resonator waveguide components wire bond fatigue wire bonds wirebond

Number of items: 196.

3D printing

Tilford, Tim ORCID: 0000-0001-8307-6403 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.04.008)

accelerated stress test

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

accelerated testing

Bailey, Christopher, Tilford, Tim and Lu, Hua (2007) Reliability analysis for power electronics modules. 2007 30th International Spring Seminar On Electronics Technology. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 12-17. ISBN 9781424412174 (doi:https://doi.org/10.1109/ISSE.2007.4432813)

additive manufacturing

Tilford, Tim ORCID: 0000-0001-8307-6403 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID: 0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2021.3049952)

adhesive materials

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)

assembly

Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2874870064 (doi:https://doi.org/10.1109/EUMC.2008.4751375)

assembly process technology

Tilford, Tim, Bailey, Christopher, Parrott, Kevin, Rizvi, M.J., Yin, Chunyan, Sinclair, Keith I. and Desmulliez, Marc P.Y. (2008) Impact of assembly process technologies on electronic packaging materials. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2739-0 (online) 978-1-4244-2740-6 (print) (doi:https://doi.org/10.1109/ICEPT.2008.4607039)

bumps

CFD

Santhanakrishnan, Mani Sekara, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2021) Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks. International Journal of Numerical Methods for Heat and Fluid Flow, 32 (3). pp. 1025-1045. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-10-2020-0656)

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

chip mountdown solder

Lu, Hua, Tilford, Tim, Xue, Xiangdong and Bailey, Christopher (2007) Thermal-mechanical modelling of power electronic module packaging. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 317-322. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.359960)

chip-on-board (COB) assembly

Tilford, Tim ORCID: 0000-0001-8307-6403 , Pavuluri, S., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270558)

cognition

Parrott, Kevin and Tilford, Tim (2007) Numerical simulation of microwave thawing using a coupled solver approach. PAMM - Proceedings in Applied Mathematics and Mechanics, 7 (1). pp. 1150601-1150602. ISSN 1617-7061 (online) (doi:https://doi.org/10.1002/pamm.200700212)

convection oven

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:https://doi.org/10.1109/IEMT.2008.5507869)

cooling efficiency

Rizvi, M.J., Skuriat, R., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Johnson, C. Mark and Lu, Hua ORCID: 0000-0002-4392-6562 (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:https://doi.org/10.1109/ESIME.2009.4938428)

coupled simulation

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

creep

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2023) Damage mechanics-based failure prediction of wirebond in power electronic module. IEEE Access. ISSN 2169-3536 (doi:https://doi.org/10.1109/ACCESS.2023.3342689)

cure

Morris, James E., Tilford, Tim, Ferenets, M. and Bailey, Christopher (2009) A critical analysis of polymer cure modeling for microelectronics applications. In: IMAPS Nordic Conference 2009, 13-15 September 2009, Tønsberg, Norway.

cure process

Sinclair, Keith I., Tilford, Tim ORCID: 0000-0001-8307-6403 , Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684409)

curing

curing processes

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Pavuluri, S. and Desmulliez, Marc P.Y. (2009) On the application of variable frequency microwave technology for processing of individual surface mount components. In: 2009 International Conference on Electronics Packaging.

cyclic thermal-mechanical loading

Lu, Hua, Tilford, Tim, Bailey, Christopher and Newcombe, David (2007) Lifetime prediction for power electronics module substrate mount-down solder interconnect. HDP'07: Proceedings Of The 2007 International Symposium On High Density Packaging And Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283558)

damage

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Tim ORCID: 0000-0001-8307-6403 , Shen, Yaochun and Hu, Yihua (2024) Reliability meta-modelling of power components. In: 2024 47th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers (IEEE), New Jersey, USA, pp. 1-7. ISBN 979-8350385489 ISSN 2161-2536 (Print), 2161-2528 (Online) (doi:https://doi.org/10.1109/ISSE61612.2024.10604175)

deformation

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Tim ORCID: 0000-0001-8307-6403 , Amalou, Farid, Cargill, Scott, Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc (2011) Modelling and optimisation study on the fabrication of nano-structures using imprint forming process. Engineering Computations, 28 (1). pp. 93-111. ISSN 0264-4401 (doi:https://doi.org/10.1108/02644401111097046)

Design tools

die attach

dielectric losses

dielectric materials

electrical configurations

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:https://doi.org/10.1115/IPACK2007-33817)

electromagnetic heating

electronic components

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Yin, Chunyan, Tilford, Tim and Ridout, Stephen (2008) Predictive reliability and prognostics for electronic components: current capabilities and future challenges. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 67-72. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276460)

electronic engineering

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910710843757)

electronic packaging

electronic products

Electronics packaging

encapsulation

end-fed probes

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

engineering design

Santhanakrishnan, Mani sekaran, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2019) Multi-material heatsink design using level-set topology optimization. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (8). pp. 1504-1513. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2019.2929017)

failure modes

failure modes and mechanisms

Bailey, Christopher, Lu, Hua and Tilford, Tim (2007) Predicting the reliability of power electronic modules. In: Keyun, Bi and Ming, Li, (eds.) ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 809-813. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441543)

fatigue failure

FDTD

finite element

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

finite element analysis

finite element analysis (FEA)

flip-chip assembly

flip-chip underfills

frequency agile microwave oven bonding system (FAMOBS)

genetic algorithm

glob top

heat sensitive film

heat sink

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Santhanakrishnan, Manisekaran, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2019) Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE. ISBN 978-1728120782 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2019.8923530)

heat sink design

heat transfer

Tilford, Tim ORCID: 0000-0001-8307-6403 , Baginski, Ed, Kelder, Jasper, Parrott, Kevin and Pericleous, Koulis A. ORCID: 0000-0002-7426-9999 (2007) Microwave modelling and validation in food thawing applications. Journal of Microwave Power & Electromagnetic Energy, 41 (4). pp. 30-45. ISSN 0832-7823

IGBT

individual surface mount components

information visualisation

inkjet printing

interaction design

isolation substrate

jet impingement cooling system

level-set method

low power tests

low-loss dielectric

machine learning

manufacturing systems

Maxwell's equations

metamodels

micro-electronics manufacture

microelectronics

microelectronics fabrication

microelectronics packaging

Ferenets, M., Tilford, Tim, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) Microwave curing of thermosetting polymer materials in microelectronics applications. In: Baltic Polymer Symposium 2009, 22-25 September 2009, Ventspils, Latvia.

microsystems

Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

microwave

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129

microwave curing

microwave devices

microwave heating

microwave oven

Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID: 0000-0001-8307-6403 , Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8

microwave ovens

microwave radiation

microwave system

microwave systems

microwaves

Miner's linear damage accumulation

modeling

Modelling

moving meshes

multi-physics

multiphysics

multiphysics modelling

nanotechnology

natural convection

numerical analysis

Zhang, Xiaotian, Hu, Yihua, Zhang, Jingwei, Esfahani, Mohammad Nasr, Tilford, Tim ORCID: 0000-0001-8307-6403 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2024) IGBT module DPT efficiency enhancement via multimodal fusion networks and graph convolution networks. IEEE Transactions on Industrial Electronics. ISSN 0278-0046 (Print), 1557-9948 (Online) (doi:https://doi.org/10.1109/TIE.2024.3368165)

numerical modelling

numerical simulations

open-ended applicator

open-ended microwave curing system

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:https://doi.org/10.1109/EPTC.2007.446975)

open-ended microwave oven

open-ended oven

open-oven

optimisation

optimization

opto-electronic assembly

packaged modules

packaging

packaging technology

Tilford, Tim ORCID: 0000-0001-8307-6403 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Thermo-mechanical modelling of power electronics module structures. 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 214-219. ISBN 1424406641 (doi:https://doi.org/10.1109/EPTC.2006.342718)

physics of failure techniques

polymer

polymer curing

polymer encapsulant

polymer materials curing

polymers

potting cure

power components

power electronic module

power electronic modules

power electronics

power electronics modules

power electronics modules (PEMs)

process efficiency

reduced order models

relative permittivity

reliability

reliability prediction

reliability prediction techniques

reliability testing

residual stress

RF-ID tag bonding

risk mitigation

rotation

shape optimisation

simulation

solder interconnects

solder joint failure

solder joints

stress and strain distribution

structural bonding

substrate delamination

thawing

thermal cycling reliability

Loh, Wei-Sun, Corfield, Martin, Lu, Hua, Hogg, Simon, Tilford, Tim and Johnson, C. Mark (2007) Wire bond reliability for power electronic modules - effect of bonding temperature. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. IEEE, New York, pp. 427-432. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.360057)

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