Items where Author is "Sinclair, Keith I."

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3D-miniaturised systems adhesive materials assembly assembly process technology bumps CFD convection oven coupled simulation cure process curing curing processes die attach dielectric losses dielectric materials electromagnetic heating electronic engineering electronic packaging electronic products end-fed probes fabrication FDTD Finite Element Analysis flip-chip assembly flip-chip underfills glob top heat sensitive film individual surface mount components low power tests low-loss dielectric micro-electronics manufacture microelectronics microelectronics packaging microwave microwave curing microwave devices microwave ovens microwave radiation microwave system microwave systems microwaves modelling methodology multiphysics Nano-Imprint Forming (NIF) open-ended microwave curing system open-ended microwave oven open-oven optimisation opto-electronic assembly packaging polymer polymer curing polymer encapsulant polymer materials curing polymers potting cure relative permittivity RF-ID tag bonding simulation structural bonding thermosetting polymer materials Variable Frequency Microwave (VFM) heating variable frequency microwave technology wafer processing wafer scale level packaging waveguide cavity resonator waveguide components

Number of items: 78.

3D-miniaturised systems

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:https://doi.org/10.1109/ESIME.2008.4525088)

adhesive materials

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)

assembly

Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2874870064 (doi:https://doi.org/10.1109/EUMC.2008.4751375)

assembly process technology

Tilford, Tim, Bailey, Christopher, Parrott, Kevin, Rizvi, M.J., Yin, Chunyan, Sinclair, Keith I. and Desmulliez, Marc P.Y. (2008) Impact of assembly process technologies on electronic packaging materials. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2739-0 (online) 978-1-4244-2740-6 (print) (doi:https://doi.org/10.1109/ICEPT.2008.4607039)

bumps

CFD

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

convection oven

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:https://doi.org/10.1109/IEMT.2008.5507869)

coupled simulation

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

cure process

Sinclair, Keith I., Tilford, Tim ORCID: 0000-0001-8307-6403 , Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684409)

curing

curing processes

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Pavuluri, S. and Desmulliez, Marc P.Y. (2009) On the application of variable frequency microwave technology for processing of individual surface mount components. In: 2009 International Conference on Electronics Packaging.

die attach

dielectric losses

dielectric materials

electromagnetic heating

electronic engineering

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910710843757)

electronic packaging

electronic products

end-fed probes

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

fabrication

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276670)

FDTD

Finite Element Analysis

flip-chip assembly

flip-chip underfills

glob top

heat sensitive film

individual surface mount components

low power tests

low-loss dielectric

micro-electronics manufacture

microelectronics

microelectronics packaging

Ferenets, M., Tilford, Tim, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) Microwave curing of thermosetting polymer materials in microelectronics applications. In: Baltic Polymer Symposium 2009, 22-25 September 2009, Ventspils, Latvia.

microwave

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129

microwave curing

microwave devices

microwave ovens

microwave radiation

microwave system

microwave systems

microwaves

modelling methodology

multiphysics

Nano-Imprint Forming (NIF)

open-ended microwave curing system

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:https://doi.org/10.1109/EPTC.2007.446975)

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