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Items where Author is "Morris, J.E."

Items where Author is "Morris, J.E."

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Abaqus® v. 6.9 axial and transverse coefficients of thermal expansion (CTE) CNT-Cu TSVs Cu vias cure data cure kinetics cure kinetics models curing of an encapsulant material curing process differential scanning calorimetry (DSC) Differential Scanning Calorimetry (DSC) dual-section microwave system effective thermal conductivity electronic packaging evaluation Fourier transform infra-red spectroscopy (FTIR) isotropic conductive adhesive materials microelectronics manufacturing microelectronics packaging microwave microwave oven numerical models packaging particle swarm optimisation algorithm particle swarm optimisation method particle swarm optimization polymer crosslinking polymer cure kinetics models polymer cure models SWCNT (single walled carbon nanotube)-Cu composites thermomechanical stress development
Number of items: 32.

Abaqus® v. 6.9

Sinha, A., Mihailovic, J.A., Morris, J.E., Hua, Lu and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application. In: Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE. Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE . IEEE Xplore Digital Library, Monterey, CA, pp. 262-266. ISBN 978-1-4244-8896-4 (doi:https://doi.org/10.1109/NMDC.2010.5652157)

axial and transverse coefficients of thermal expansion (CTE)

Sinha, A., Mihailovic, J.A., Morris, J.E., Hua, Lu and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application. In: Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE. Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE . IEEE Xplore Digital Library, Monterey, CA, pp. 262-266. ISBN 978-1-4244-8896-4 (doi:https://doi.org/10.1109/NMDC.2010.5652157)

CNT-Cu TSVs

Sinha, A., Mihailovic, J.A., Morris, J.E., Hua, Lu and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application. In: Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE. Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE . IEEE Xplore Digital Library, Monterey, CA, pp. 262-266. ISBN 978-1-4244-8896-4 (doi:https://doi.org/10.1109/NMDC.2010.5652157)

Cu vias

Sinha, A., Mihailovic, J.A., Morris, J.E., Hua, Lu and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application. In: Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE. Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE . IEEE Xplore Digital Library, Monterey, CA, pp. 262-266. ISBN 978-1-4244-8896-4 (doi:https://doi.org/10.1109/NMDC.2010.5652157)

cure data

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642820)

cure kinetics

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642820)

cure kinetics models

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:https://doi.org/10.1109/ISSE.2010.5547360)

curing of an encapsulant material

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

curing process

Tilford, T. ORCID: 0000-0001-8307-6403 , Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642822)

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:https://doi.org/10.1260/1748-3018.4.1.121)

differential scanning calorimetry (DSC)

Morris, J.E., Tilford, T. ORCID: 0000-0001-8307-6403 , Bailey, C. ORCID: 0000-0002-9438-3879 , Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:https://doi.org/10.1109/ISSE.2009.5206929)

Differential Scanning Calorimetry (DSC)

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:https://doi.org/10.1109/ISSE.2010.5547360)

dual-section microwave system

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

effective thermal conductivity

Sinha, A., Mihailovic, J.A., Morris, J.E., Hua, Lu and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application. In: Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE. Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE . IEEE Xplore Digital Library, Monterey, CA, pp. 262-266. ISBN 978-1-4244-8896-4 (doi:https://doi.org/10.1109/NMDC.2010.5652157)

electronic packaging

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

evaluation

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:https://doi.org/10.1260/1748-3018.4.1.121)

Fourier transform infra-red spectroscopy (FTIR)

Morris, J.E., Tilford, T. ORCID: 0000-0001-8307-6403 , Bailey, C. ORCID: 0000-0002-9438-3879 , Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:https://doi.org/10.1109/ISSE.2009.5206929)

isotropic conductive adhesive materials

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:https://doi.org/10.1109/ISSE.2010.5547360)

microelectronics manufacturing

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:https://doi.org/10.1260/1748-3018.4.1.121)

microelectronics packaging

Morris, J.E., Tilford, T. ORCID: 0000-0001-8307-6403 , Bailey, C. ORCID: 0000-0002-9438-3879 , Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:https://doi.org/10.1109/ISSE.2009.5206929)

microwave

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

microwave oven

Tilford, T. ORCID: 0000-0001-8307-6403 , Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642822)

numerical models

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:https://doi.org/10.1260/1748-3018.4.1.121)

packaging

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

particle swarm optimisation algorithm

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:https://doi.org/10.1260/1748-3018.4.1.121)

particle swarm optimisation method

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:https://doi.org/10.1109/ISSE.2010.5547360)

particle swarm optimization

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642820)

polymer crosslinking

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:https://doi.org/10.1109/ISSE.2010.5547360)

polymer cure kinetics models

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:https://doi.org/10.1260/1748-3018.4.1.121)

polymer cure models

Morris, J.E., Tilford, T. ORCID: 0000-0001-8307-6403 , Bailey, C. ORCID: 0000-0002-9438-3879 , Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:https://doi.org/10.1109/ISSE.2009.5206929)

SWCNT (single walled carbon nanotube)-Cu composites

Sinha, A., Mihailovic, J.A., Morris, J.E., Hua, Lu and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application. In: Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE. Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE . IEEE Xplore Digital Library, Monterey, CA, pp. 262-266. ISBN 978-1-4244-8896-4 (doi:https://doi.org/10.1109/NMDC.2010.5652157)

thermomechanical stress development

Tilford, T. ORCID: 0000-0001-8307-6403 , Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642822)

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