Items where Author is "Morris, J.E."
Article
Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Desmulliez, M.P.Y. and Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879
(2010)
Application of particle swarm optimisation to evaluation of
polymer cure kinetics models.
Journal of Algorithms & Computational Technology, 4 (1).
pp. 121-146.
ISSN 1748-3018
(doi:10.1260/1748-3018.4.1.121)
Conference Proceedings
Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879
(2010)
Numerical analysis of microwave underfill cure in ball-grid packages.
In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings.
IEEE Computer Society, Piscataway, USA, pp. 1-6.
ISBN 9781424485536 (Print), 9781424485543 (Online)
(doi:10.1109/ESTC.2010.5642822)
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879
(2010)
On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications.
In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings.
IEEE Computer Society, Piscataway, USA, pp. 1-6.
ISBN 9781424485536 (Print), 9781424485543 (Online)
(doi:10.1109/ESTC.2010.5642820)
Sinha, A., Mihailovic, J.A., Morris, J.E., Hua, Lu and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879
(2010)
Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application.
In: Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE.
Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE
.
IEEE Xplore Digital Library, Monterey, CA, pp. 262-266.
ISBN 978-1-4244-8896-4
(doi:10.1109/NMDC.2010.5652157)
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879
(2010)
Numerical analysis of polymer cure kinetics in isotropic conductive adhesives.
In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010.
Polymer Electronics and Nanotechnologies: Towards System Integration
.
IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416.
ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN)
(doi:10.1109/ISSE.2010.5547360)
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879
(2010)
Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages.
In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings.
International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35.
ISSN 1070-0129
Morris, J.E., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879, Sinclair, K.I. and Desmulliez, M.P.Y.
(2009)
Polymer cure modeling for microelectronics applications.
In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.
ISBN 978-1-4244-4260-7 (print)
(doi:10.1109/ISSE.2009.5206929)