Items where Author is "Goussetis, George"

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adhesive materials assembly bumps convection oven cure process curing die attach dielectric losses dielectric materials electromagnetic heating electronic engineering electronic products end-fed probes flip-chip assembly flip-chip underfills glob top heat sensitive film low power tests low-loss dielectric micro-electronics manufacture microwave curing microwave devices microwave oven microwave ovens microwave radiation microwave system microwave systems microwaves open-ended applicator open-ended microwave curing system open-ended microwave oven open-oven opto-electronic assembly packaging polymer encapsulant polymer materials curing polymers potting cure relative permittivity RF-ID tag bonding simulation structural bonding thermal processing thermosetting polymer materials variable frequency microwave technology wafer processing wafer scale level packaging waveguide cavity resonator waveguide components

Number of items: 51.

adhesive materials

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

assembly

Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2874870064 (doi:10.1109/EUMC.2008.4751375)

bumps

convection oven

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Sinclair, Keith I., Goussetis, George, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:10.1109/IEMT.2008.5507869)

cure process

Sinclair, Keith I., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Goussetis, George, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684409)

curing

die attach

dielectric losses

dielectric materials

electromagnetic heating

electronic engineering

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Sinclair, Keith I., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:10.1108/09540910710843757)

electronic products

end-fed probes

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

flip-chip assembly

flip-chip underfills

glob top

heat sensitive film

low power tests

low-loss dielectric

micro-electronics manufacture

microwave curing

microwave devices

microwave oven

Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8

microwave ovens

microwave radiation

microwave system

microwave systems

microwaves

open-ended applicator

open-ended microwave curing system

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:10.1109/EPTC.2007.446975)