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Items where Author is "Adamietz, R."

Items where Author is "Adamietz, R."

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Number of items: 39.

computer control systems

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

conversion efficiency

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

cure kinetics models

Tilford, T. ORCID: 0000-0001-8307-6403, Ferenets, M., Adamietz, R., Pavuluri, S. K., Desmulliez, M. P. Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 262-267. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:https://doi.org/10.1109/EPTC.2011.6184428)

curing

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:https://doi.org/10.1109/EPTC.2011.6184486)

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: 0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Experimental investigation of open-ended microwave oven assisted encapsulation process. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-8553-6 (print), 978-1-4244-8554-3 (online) (doi:https://doi.org/10.1109/ESTC.2010.5643015)

curing encapsulant materials

Adamietz, R., Tilford, T. ORCID: 0000-0001-8307-6403, Ferenets, M., Desmulliez, M.P.Y., Muller, G., Othman, N and Eicher, F. (2010) Modular microwave-based system for packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)

curing of an encapsulant material

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

curing process

Tilford, T. ORCID: 0000-0001-8307-6403, Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642822)

design

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

differential scanning calorimetry

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

dual-section microwave system

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

electromagnetic heating

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:https://doi.org/10.1109/EPTC.2011.6184486)

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: 0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:https://doi.org/10.1109/TCPMT.2011.2177524)

electronic packaging

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

electronics packaging

Adamietz, R., Tilford, T. ORCID: 0000-0001-8307-6403, Ferenets, M., Desmulliez, M.P.Y., Muller, G., Othman, N and Eicher, F. (2010) Modular microwave-based system for packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)

encapsulant material

Tilford, T. ORCID: 0000-0001-8307-6403, Ferenets, M., Adamietz, R., Pavuluri, S. K., Desmulliez, M. P. Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 262-267. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:https://doi.org/10.1109/EPTC.2011.6184428)

encapsulants

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:https://doi.org/10.1109/EPTC.2011.6184486)

encapsulation

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: 0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:https://doi.org/10.1109/TCPMT.2011.2177524)

heating

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

materials

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:https://doi.org/10.1109/EPTC.2011.6184486)

microwave

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

microwave curing system

Adamietz, R., Müller, G., Othman, N., Eicher, F., Tilford, T. ORCID: 0000-0001-8307-6403, Ferenets, M., Pavuluri, S.K., Desmulliez, M. P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) On the integration of microwave curing systems into microelectronics assembly processes. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642827)

microwave devices

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

microwave energy

Adamietz, R., Müller, G., Othman, N., Eicher, F., Tilford, T. ORCID: 0000-0001-8307-6403, Ferenets, M., Pavuluri, S.K., Desmulliez, M. P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) On the integration of microwave curing systems into microelectronics assembly processes. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642827)

microwave measurements

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:https://doi.org/10.1109/EPTC.2011.6184486)

microwave oven

Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID: 0000-0001-8307-6403, Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8

Tilford, T. ORCID: 0000-0001-8307-6403, Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642822)

microwave ovens

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:https://doi.org/10.1109/EPTC.2011.6184486)

microwave theory and techniques

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:https://doi.org/10.1109/EPTC.2011.6184486)

open-ended applicator

Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID: 0000-0001-8307-6403, Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8

open-ended microwave oven

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: 0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Experimental investigation of open-ended microwave oven assisted encapsulation process. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-8553-6 (print), 978-1-4244-8554-3 (online) (doi:https://doi.org/10.1109/ESTC.2010.5643015)

ovens

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

packaging

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: 0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:https://doi.org/10.1109/TCPMT.2011.2177524)

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

resonant microwave applicator

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:https://doi.org/10.1109/EPTC.2011.6184486)

stoves

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

temperature measurement

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:https://doi.org/10.1109/EPTC.2011.6184486)

thermal processing

Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID: 0000-0001-8307-6403, Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8

thermomechanical stress development

Tilford, T. ORCID: 0000-0001-8307-6403, Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642822)

This list was generated on Fri Jul 19 05:40:38 2019 UTC.