Items where Author is "Adamietz, R."
Article
Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879
(2012)
Encapsulation of microelectronic components using open-ended microwave oven.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5).
pp. 799-806.
ISSN 2156-3950
(doi:10.1109/TCPMT.2011.2177524)
Book Section
Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879
(2011)
Open-ended single mode resonant applicator for microelectronics packaging applications.
Proceedings of the Microwave Heating and Processing of Materials Seminar 2011.
IET, pp. 89-91.
ISBN 978 1 84919 310 8
Conference Proceedings
Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Adamietz, R., Pavuluri, S. K., Desmulliez, M. P. Y. and Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879
(2012)
Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials.
In: Electronics Packaging Technology Conference (EPTC), 2011 13th.
IEEE Conference Publications
.
Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 262-267.
ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online)
(doi:10.1109/EPTC.2011.6184428)
Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879
(2012)
Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator.
In: Electronics Packaging Technology Conference (EPTC), 2011 13th.
Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578.
ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online)
(doi:10.1109/EPTC.2011.6184486)
Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879
(2010)
Experimental investigation of open-ended microwave oven assisted encapsulation process.
In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings.
IEEE Computer Society, Piscataway, NJ, USA, pp. 1-6.
ISBN 978-1-4244-8553-6 (print), 978-1-4244-8554-3 (online)
(doi:10.1109/ESTC.2010.5643015)
Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879
(2010)
Numerical analysis of microwave underfill cure in ball-grid packages.
In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings.
IEEE Computer Society, Piscataway, USA, pp. 1-6.
ISBN 9781424485536 (Print), 9781424485543 (Online)
(doi:10.1109/ESTC.2010.5642822)
Adamietz, R., Müller, G., Othman, N., Eicher, F., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Pavuluri, S.K., Desmulliez, M. P.Y. and Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879
(2010)
On the integration of microwave curing systems into microelectronics assembly processes.
In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings.
IEEE Computer Society, Piscataway, USA, pp. 1-6.
ISBN 9781424485536 (Print), 9781424485543 (Online)
(doi:10.1109/ESTC.2010.5642827)
Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879
(2010)
Advances in the design and test of a novel open ended microwave oven.
In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010.
IEEE Computer Society, Piscataway, USA, pp. 247-252.
ISBN 9781424466368 (Print), 9782355000119 (Online)
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879
(2010)
Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages.
In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings.
International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35.
ISSN 1070-0129
Conference or Conference Paper
Adamietz, R., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Desmulliez, M.P.Y., Muller, G., Othman, N and Eicher, F.
(2010)
Modular microwave-based system for packaging applications.
In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan.
(Unpublished)