ACF, failure, contact resistance, ageing, computer modelling

Rizvi, M.J., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:10.1016/j.mejo.2008.01.045)

Design for Reliability modelling, System-in-Package (SiP) structures, NXP, Wafer Level Packaging (WLP), Finite Element Analysis (FEA)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684364)

Wettability, Sn-2.8Ag-0.5Cu-1.0Bi, wetting force, contact angle, flux, surface, tension, finite element modeling, intermetallic compounds

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

adhesion, strength of materials, ageing (materials), films (states of matter)

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 and Sharif, A. (2005) The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing. Soldering & Surface Mount Technology, 17 (2). pp. 40-48. ISSN 0954-0911 (doi:10.1108/09540910510597492)

adhesive, curing, glass transition temperature, loss modulus, storage modulus

Rizvi, M.J., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:10.1016/j.mee.2007.05.045)

chip-on-flex (COF), anisotropic conductive film (ACF), finite element modelling, stress, conductive particle, contact resistance, life-time

Rizvi, M.J., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:10.1109/ITHERM.2006.1645436)

damage, solder joints, computer modelling, flexible circuit board, thermal cycling

Rizvi, M.J., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 (2010) Damage predictions in a chip resistor solder joint on flexible circuit board. Microelectronic Engineering, 87 (10). pp. 1889-1895. ISSN 0167-9317 (doi:10.1016/j.mee.2009.11.023)

flexible substrates, thermo-mechanical, lead free solder

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Rizvi, M.J., Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2006) Thermal-mechanical analysis of flexible substrates during lead-free solder reflow. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1007-1011. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280134)

flexible-substrates, Flex-No-Lead project, lead-free soldering

Rizvi, M.J., Yin, C.Y ORCID: https://orcid.org/0000-0003-0298-0420, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

jet impingement cooling system, power electronics modules (PEMs), cooling efficiency, numerical modelling

Rizvi, M.J., Skuriat, R., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Johnson, C. Mark and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:10.1109/ESIME.2009.4938428)

modeling, copper, diffusion, solder

Rizvi, M.J., Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:10.1016/j.tsf.2008.09.105)

multi-physics, multi-disciplinary design,

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Rizvi, J. and Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420 (2009) Co-design and multi-physics analysis for power electronic modules. In: 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. IEEE Computer Society, Piscataway, NJ USA. ISBN 9781424441600 (doi:10.1109/ESIME.2009.4938505)

solder, joints, computer modelling, flexible substrates, reliability

Rizvi, M.J., Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2006) Modeling the effect of lead-free soldering on flexible substrates. Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on 11-14 Dec. 2006. IEEE, Piscataway, NJ, USA, pp. 1038-1042. ISBN 1424408334; 1424408342 (doi:10.1109/EMAP.2006.4430695)

solder, joints, electronic packaging, wetting, computer modelling

Rizvi, M.J., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2006) Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 145-151. ISBN 142440553X (doi:10.1109/ITHERM.2006.1645436)

solder, wetting, aging, intermetallic compound layer

Rizvi, M.J., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C., Islam, M. and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

soldering, interfacial reactions, intermetallic compounds, growth rate, aging

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

thick film chip resistors, SnPb and SnAgCu (solder alloys), Garofalo equation,Miner's law of linear damage accumulation

Rizvi, M.J., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Bevan, E., Poutney, N. and Coates, J. (2010) Finite element modelling of failures in thick film chip resistor solder joints. In: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010. in: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International Issue Date: 20-22 Oct. 2010 . IEEE Xplore Digital Library, Taipei, pp. 1-4. ISBN 978-1-4244-9785-0 (electronic), 978-1-4244-9783-6 (print) ISSN 2150-5934 (doi:10.1109/IMPACT.2010.5699488)

wetting, solder, flux, wetting force, contact angle, modeling

Rizvi, M.J., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)