Skip navigation

Items where Greenwich Author is "Alam, Mohammad"

Items where Greenwich Author is "Alam, Mohammad"

[up] Up a level
Group by: Item Type | Date | Funders | Uncontrolled Keywords | No Grouping
Jump to: 3D-Mintegration consortium (supported under EPSRC fund EP/C534212/) | Cassidian Electronics | City University of Hong Kong, Strategic Reearch Grant (project no. 7001080) | EU funded Marie Curie Incoming International Fellowship | EU under the Marie Curie Incoming International Fellowship | Engineering and Physical Sciences Research Council (EPSRC) | European Union | General Dynamics | Hong Kong Innovation and Technology Commission for Conductive Adhesive Technology Program for Fine Pitch Electronic Interconnect (Project no. ITS/182/00) | Hong Kong Research Grant Council fund for Cooperative Research Center on Conductive Adhesive Technology for High Density Electronic Packaging (Project no. 8720003) | National Natural Science Foundation of China | Research Grants Council of Hong Kong Joint Research Scheme (Project No. N_CityU103/03) | Rolls Royce | Selex Galileo
Number of items: 15.

3D-Mintegration consortium (supported under EPSRC fund EP/C534212/)

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

Cassidian Electronics

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273091)

City University of Hong Kong, Strategic Reearch Grant (project no. 7001080)

Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00068-9)

EU funded Marie Curie Incoming International Fellowship

Alam, M.O., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:10.1016/j.commatsci.2008.12.001)

Alam, M.O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684445)

EU under the Marie Curie Incoming International Fellowship

Alam, M.O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C (2009) Finite-element simulation of stress intensity factors in solder joint intermetallic compounds. IEEE Transactions on Device and Materials Reliability, 9 (1). pp. 40-48. ISSN 1530-4388 (doi:10.1109/TDMR.2008.2010595)

Engineering and Physical Sciences Research Council (EPSRC)

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

European Union

Alam, M. O., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)

General Dynamics

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273091)

Hong Kong Innovation and Technology Commission for Conductive Adhesive Technology Program for Fine Pitch Electronic Interconnect (Project no. ITS/182/00)

Yin, C.Y. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Alam, M.O., Chan, Y.C., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00348-7)

Hong Kong Research Grant Council fund for Cooperative Research Center on Conductive Adhesive Technology for High Density Electronic Packaging (Project no. 8720003)

Yin, C.Y. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Alam, M.O., Chan, Y.C., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00348-7)

National Natural Science Foundation of China

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)

Research Grants Council of Hong Kong Joint Research Scheme (Project No. N_CityU103/03)

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)

Rolls Royce

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273091)

Selex Galileo

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273091)

This list was generated on Sun Dec 22 03:00:57 2024 UTC.