Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy ORCID: 0000-0001-8307-6403 , Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:https://doi.org/10.1109/EuroSimE60745.2024.10491522)

Preview

PDF (AAM) 46435_STOYANOV_Physics-informed_Machine_Learning_for_predicting_fatigue_damage_of_wire_bonds.pdf - Accepted Version Available under License Creative Commons Attribution. Download (722kB) | Preview

Abstract

This paper details a novel physics-informed data-driven approach for developing computationally fast metamodels for predicting fatigue damage and its spatial distribution at common failure sites of power electronic components. The proposed metamodels aim to serve the end-users of these power components by allowing an informative model-based assessment of the thermal fatigue damage in the assembly materials due to different application-specific, qualification and user-defined load conditions, removing current requirements for comprehensive device characterisations and deploying complex finite element (FE) models. The proposed methodology is demonstrated with two different metamodel structures, a multi-quadratic function, and a neural network, for the problem of predicting the thermal fatigue damage due to temperature cycling loads in the wire bonds of an IGBT power electronic module (PEM). The results confirmed that the proposed approach and the modelling technology can offer FE-matching accuracy and capability to map highly nonlinear spatial distributions of the damage parameter over local sub-domains associated with material fatigue degradation and failure due to material/interfacial cracking.

Item Type:	Conference Proceedings
Title of Proceedings:	2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Uncontrolled Keywords:	power electronic module; reliability; machine learning; ML; metamodel; wire bonds; failure; finite element analysis; damage modelling
Subjects:	Q Science > Q Science (General) Q Science > QA Mathematics Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Faculty / School / Research Centre / Research Group:	Faculty of Engineering & Science Faculty of Engineering & Science > School of Computing & Mathematical Sciences (CMS)
Related URLs:	Organisation
Last Modified:	19 Sep 2024 12:00
URI:	http://gala.gre.ac.uk/id/eprint/46435

Actions (login required)

View Item

Downloads