Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2008) Viscoelastic properties of solder paste and isotropic conductive adhesives used for flip-chip assembly. In: Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 1-8. ISBN 9781424433926 (print), 9781424433933 (electronic) ISSN 1089-8190 (doi:https://doi.org/10.1109/IEMT.2008.5507801)

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Abstract

The printing of pastes (solder pastes and isotropic conductive adhesives) through very small stencil apertures required for flip-chip pitch sizes is expected to result in increased stencil clogging and incomplete transfer of paste to the printed circuit board pads. There is wide agreement in industry that the paste printing process accounts for the majority of assembly defects, and most defects originate from poor understanding of the effect of printing process parameters on printing performance.

Item Type:	Conference Proceedings
Title of Proceedings:	Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International
Additional Information:	This paper was given at the 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008, held 4-6 November 2008, Penang, Malaysia. The authors would like to acknowledge the support of Henkel Technologies (UK).
Uncontrolled Keywords:	solder pastes, isotropic conductive adhesives,
Subjects:	T Technology > T Technology (General) T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Engineering School of Engineering > Department of Engineering Systems School of Engineering > Manufacturing Engineering Research Group
Related URLs:	Publisher Organisation
Last Modified:	27 Jan 2020 12:54
URI:	http://gala.gre.ac.uk/id/eprint/2652

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