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3D printed microneedle patches using stereolithography (SLA) for intradermal insulin delivery

3D printed microneedle patches using stereolithography (SLA) for intradermal insulin delivery

Economidou, Sophia N., Pissinato Pere, Cristiane Patricia, Reid, Andrew, Uddin, Jasim Md., Windmill, James F.C., Lamprou, Dimitrios A. and Douroumis, Dennis ORCID logoORCID: https://orcid.org/0000-0002-3782-0091 (2019) 3D printed microneedle patches using stereolithography (SLA) for intradermal insulin delivery. Materials Science and Engineering C, 102. pp. 743-755. ISSN 0928-4931 (doi:10.1016/j.msec.2019.04.063)

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Abstract

3D printed microneedle arrays were fabricated using a biocompatible resin through stereolithography (SLA) for transdermal insulin delivery. Microneedles were built by polymerising consecutive layers of a photopolymeric resin. Thin layers of insulin and sugar alcohol or disaccharide carriers were formed on the needle surface by inkjet printing. The optimization of the printing process resulted in superior skin penetration capacity of the 3D printed microneedles compared to metal arrays with minimum applied forces varying within the range of 2 to 5 N. Micro-CT analysis showed strong adhesion of the coated films on the microneedle surface even after penetration to the skin. In vivo animal trials revealed fast insulin action with excellent hypoglycaemia control and lower glucose levels achieved within 60 min, combined with steady state plasma glucose over 4 h compared to subcutaneous injections.

Item Type: Article
Uncontrolled Keywords: 3D printing; Microneedles; Inkjet coating; Insulin; μCT
Subjects: T Technology > T Technology (General)
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Faculty / School / Research Centre / Research Group: Faculty of Engineering & Science
Faculty of Engineering & Science > Centre for Innovation and Process Engineering in Research (CIPER)
Faculty of Engineering & Science > School of Science (SCI)
Last Modified: 30 Apr 2020 17:34
URI: http://gala.gre.ac.uk/id/eprint/23926

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