Nwanoro, Kenneth C., Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Using FloTHERM XT and ANSYS workbench to perform Thermo-Mechanical analysis. Engineering Edge. (In Press)

PDF (Author Accepted Manuscript) 21964 NWANORO_Using_FloTHERM XT_and_ANSYS_Workbench_2018.pdf - Accepted Version Restricted to Repository staff only Download (619kB) | Request a copy

Abstract

Thermally induced stress in electronic products is a growing concern for electronic package designers. These stresses result in material degradation of the package, and lead to a wear-out mechanism known as fatigue. Depending on the magnitude of these stresses, fatigue can result in premature loss of performance and hence reliability of the overall product. This impact of fatigue is governed by (i) system design (ii) non-uniform temperature distribution during operation and (iii) mismatch in materials properties (e.g. co-efficient of thermal expansion (CTE).

Accurately predicting the magnitude of stress requires a coupled thermo-mechanical analysis. First, the nonuniform temperature distribution across the system needs to be predicted, taking into account the relevant heat sources and heat transfer mechanisms. Secondly, the resulting deformation, strain (including creep) and stress distributions across the package needs to be predicted.

Best-in-class analysis tools used by electronic product designers treat thermal and mechanical (Stress) design separately. In particular, CFD tools are used for thermal analysis and FEA tools are used for mechanical design. Although thermo-mechanical analysis, using FEA tools, is not new, the majority of reported work assumes that temperature changes across the package/system are constant. Of course, in reality, this is not the case. Current trends in both micro and power electronics packaging include the use of 3D-ICs, Through Silicon Vias, WaferLevel Packaging, Higher switching frequency, etc, and operating in higher temperature environments. Hence there is an increasing need to enable thermal and mechanical design engineers to work collaboratively using best-in-class analysis tools.

Item Type:	Article
Uncontrolled Keywords:	Numerical software, Mapping, Thermo-mechanical analysis, Power cycling, FEA, CFD, ANSYS, Flotherm XT
Subjects:	Q Science > QA Mathematics
Faculty / School / Research Centre / Research Group:	Faculty of Engineering & Science Faculty of Engineering & Science > School of Computing & Mathematical Sciences (CMS)
Related URLs:	Publisher
Last Modified:	12 Sep 2023 12:08
URI:	http://gala.gre.ac.uk/id/eprint/21964

Actions (login required)

View Item

Downloads