Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Microelectronics Reliability, 67. pp. 111-119. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.10.017)

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Abstract

Qualification analysis and reliability testing of electronic components represent a major activity in the process of development of electronic equipment. Electronics manufacturers have to adopt often costly test programmes to ensure qualification standards and reliability requirements are met. This paper details a novel similarity-based qualification approach for assessing expected reliability of electronic components, and in general electronic prod- ucts, as an alternative to conventional physical testing. The originality of this work is in the proposed approach which introduces a new way of qualifying electronic components based on similarity with previously assessed and qualified components. This novel approach has the potential to transform in a major way the current oper- ational practices in the industry, demanding at present substantial physical testing, by offering a complementary, “virtual qualification” route for addressing the cost and time challenges associated with qualification tests. A major achievement is the comprehensive and detailed demonstration of the proposed reliability qualification approach. Case studies on qualifying electronic components to the thermal loads induced by a particular post- manufacturing process widely adopted by high-reliability electronics sectors – the robotic hot solder dip (refinishing) process, and associated risks of thermo-mechanical damage are presented and discussed.

Item Type:	Article
Uncontrolled Keywords:	Modelling; Electronic Packaging; Reliability
Subjects:	Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Faculty / School / Research Centre / Research Group:	Faculty of Engineering & Science > Centre for Numerical Modelling & Process Analysis (CNMPA) > Computational Mechanics & Reliability Group (CMRG) Faculty of Engineering & Science > School of Computing & Mathematical Sciences (CMS) Faculty of Engineering & Science
Last Modified:	04 Mar 2022 13:07
URI:	http://gala.gre.ac.uk/id/eprint/17116

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