Skip navigation

Browse by Journal Title

Browse by Journal Title

[up] Up a level
Group by: Creators | Item Type | Uncontrolled Keywords | No Grouping
copper diffusion Electromigration modeling Modelling solder Solder material Thermomigration Thin film
Number of items: 9.

copper

Rizvi, M.J., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:10.1016/j.tsf.2008.09.105)

diffusion

Rizvi, M.J., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:10.1016/j.tsf.2008.09.105)

Electromigration

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S. H., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

modeling

Rizvi, M.J., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:10.1016/j.tsf.2008.09.105)

Modelling

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S. H., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

solder

Rizvi, M.J., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:10.1016/j.tsf.2008.09.105)

Solder material

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S. H., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

Thermomigration

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S. H., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

Thin film

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S. H., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

This list was generated on Sat Dec 21 15:44:58 2024 UTC.