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Rizvi, M.J., Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Christopher
ORCID: 0000-0002-9438-3879
(2009)
Modeling the diffusion of solid copper into liquid solder alloys.
Thin Solid Films, 517 (5).
pp. 1686-1689.
ISSN 0040-6090
(doi:https://doi.org/10.1016/j.tsf.2008.09.105)
Zhu, X., Kotadia, H., Xu, S., Lu, H.
ORCID: 0000-0002-4392-6562
, Mannan, S. H., Bailey, C.
ORCID: 0000-0002-9438-3879
and Chan, Y. C.
(2014)
Electromigration in Sn-Ag solder thin films under high current density.
Thin Solid Films, 565.
pp. 193-201.
ISSN 0040-6090
(doi:https://doi.org/10.1016/j.tsf.2014.06.030)