Skip navigation

Browse by Journal Title

Browse by Journal Title

Up a level
Export as [feed] RSS
Group by: Creators | Item Type | Uncontrolled Keywords | No Grouping
Number of items: 24.

accelerated stress test

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403, Bailey, Chris ORCID: 0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

conformal coating

Yin, Chunyan ORCID: 0000-0003-0298-0420, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical Analysis of Conformally Coated QFNs for High Reliability Applications. IEEE Transactions on Components, Packaging and Manufacturing Technology. ISSN 2156-3950 (Print), 2156-3985 (Online) (In Press) (doi:https://doi.org/10.1109/TCPMT.2019.2925874)

convection oven

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403, Bailey, Chris ORCID: 0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

electromagnetic heating

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: 0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:https://doi.org/10.1109/TCPMT.2011.2177524)

Electronic Packaging

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2017.2688021)

encapsulation

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403, Bailey, Chris ORCID: 0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: 0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:https://doi.org/10.1109/TCPMT.2011.2177524)

engineering design

Santhanakrishnan, Mani sekaran, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2019) Multi-material heatsink design using level-set topology optimization. IEEE Transactions on Components, Packaging and Manufacturing Technology. ISSN 2156-3950 (Print), 2156-3985 (Online) (In Press) (doi:https://doi.org/10.1109/TCPMT.2019.2929017)

finite element analysis

Yin, Chunyan ORCID: 0000-0003-0298-0420, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical Analysis of Conformally Coated QFNs for High Reliability Applications. IEEE Transactions on Components, Packaging and Manufacturing Technology. ISSN 2156-3950 (Print), 2156-3985 (Online) (In Press) (doi:https://doi.org/10.1109/TCPMT.2019.2925874)

level-set method

Santhanakrishnan, Mani sekaran, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2019) Multi-material heatsink design using level-set topology optimization. IEEE Transactions on Components, Packaging and Manufacturing Technology. ISSN 2156-3950 (Print), 2156-3985 (Online) (In Press) (doi:https://doi.org/10.1109/TCPMT.2019.2929017)

microelectronics

Santhanakrishnan, Mani sekaran, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2019) Multi-material heatsink design using level-set topology optimization. IEEE Transactions on Components, Packaging and Manufacturing Technology. ISSN 2156-3950 (Print), 2156-3985 (Online) (In Press) (doi:https://doi.org/10.1109/TCPMT.2019.2929017)

microelectronics packaging

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403, Bailey, Chris ORCID: 0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

microwave curing

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403, Bailey, Chris ORCID: 0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

Multiphysics modelling

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2017.2688021)

open-ended oven

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403, Bailey, Chris ORCID: 0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

packaging

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: 0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:https://doi.org/10.1109/TCPMT.2011.2177524)

Press-Pack assembly

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2017.2688021)

QFN

Yin, Chunyan ORCID: 0000-0003-0298-0420, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical Analysis of Conformally Coated QFNs for High Reliability Applications. IEEE Transactions on Components, Packaging and Manufacturing Technology. ISSN 2156-3950 (Print), 2156-3985 (Online) (In Press) (doi:https://doi.org/10.1109/TCPMT.2019.2925874)

reliability

Yin, Chunyan ORCID: 0000-0003-0298-0420, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical Analysis of Conformally Coated QFNs for High Reliability Applications. IEEE Transactions on Components, Packaging and Manufacturing Technology. ISSN 2156-3950 (Print), 2156-3985 (Online) (In Press) (doi:https://doi.org/10.1109/TCPMT.2019.2925874)

reliability testing

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403, Bailey, Chris ORCID: 0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

residual stress

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403, Bailey, Chris ORCID: 0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

thermal cycling

Yin, Chunyan ORCID: 0000-0003-0298-0420, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical Analysis of Conformally Coated QFNs for High Reliability Applications. IEEE Transactions on Components, Packaging and Manufacturing Technology. ISSN 2156-3950 (Print), 2156-3985 (Online) (In Press) (doi:https://doi.org/10.1109/TCPMT.2019.2925874)

thermal management

Santhanakrishnan, Mani sekaran, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2019) Multi-material heatsink design using level-set topology optimization. IEEE Transactions on Components, Packaging and Manufacturing Technology. ISSN 2156-3950 (Print), 2156-3985 (Online) (In Press) (doi:https://doi.org/10.1109/TCPMT.2019.2929017)

Topological optimization

Santhanakrishnan, Mani sekaran, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2019) Multi-material heatsink design using level-set topology optimization. IEEE Transactions on Components, Packaging and Manufacturing Technology. ISSN 2156-3950 (Print), 2156-3985 (Online) (In Press) (doi:https://doi.org/10.1109/TCPMT.2019.2929017)

This list was generated on Mon Aug 19 17:25:21 2019 UTC.