Browse by Journal Title
![]() | Up a level |
accelerated stress test
Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim
ORCID: 0000-0001-8307-6403
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Schreier-Alt, Thomas and Warmuth, Jens
(2018)
Reliability testing and stress measurement of QFN
packages encapsulated by an open-ended microwave
curing system.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1).
pp. 173-180.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2018.2859031)
additive manufacturing
Tilford, Tim
ORCID: 0000-0001-8307-6403
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2021)
Comparative reliability of inkjet-printed electronics packaging.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2).
pp. 351-362.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2021.3049952)
commercial off-the-shelf components
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Stewart, Paul, Parker, Mike and Roulston, John F.
(2020)
Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3).
pp. 502-515.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2020.2972635)
component terminations
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Stewart, Paul, Parker, Mike and Roulston, John F.
(2020)
Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3).
pp. 502-515.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2020.2972635)
conformal coating
Yin, Chunyan
ORCID: 0000-0003-0298-0420
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Christopher
ORCID: 0000-0002-9438-3879
and Stewart, Paul
(2019)
Thermo-mechanical analysis of conformally coated QFNs for high reliability applications.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11).
pp. 2210-2218.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2019.2925874)
convection oven
Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim
ORCID: 0000-0001-8307-6403
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Schreier-Alt, Thomas and Warmuth, Jens
(2018)
Reliability testing and stress measurement of QFN
packages encapsulated by an open-ended microwave
curing system.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1).
pp. 173-180.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2018.2859031)
electromagnetic heating
Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T.
ORCID: 0000-0001-8307-6403
, Adamietz, R., Muller, G., Eicher, F. and Bailey, C.
ORCID: 0000-0002-9438-3879
(2012)
Encapsulation of microelectronic components using open-ended microwave oven.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5).
pp. 799-806.
ISSN 2156-3950
(doi:https://doi.org/10.1109/TCPMT.2011.2177524)
Electronic Packaging
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Ortiz-Gonzalez, Jose Angel, Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, Chris
ORCID: 0000-0002-9438-3879
and Alatise, Olawiwola
(2017)
A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6).
pp. 893-900.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2017.2688021)
encapsulation
Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim
ORCID: 0000-0001-8307-6403
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Schreier-Alt, Thomas and Warmuth, Jens
(2018)
Reliability testing and stress measurement of QFN
packages encapsulated by an open-ended microwave
curing system.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1).
pp. 173-180.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2018.2859031)
Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T.
ORCID: 0000-0001-8307-6403
, Adamietz, R., Muller, G., Eicher, F. and Bailey, C.
ORCID: 0000-0002-9438-3879
(2012)
Encapsulation of microelectronic components using open-ended microwave oven.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5).
pp. 799-806.
ISSN 2156-3950
(doi:https://doi.org/10.1109/TCPMT.2011.2177524)
engineering design
Santhanakrishnan, Mani sekaran, Tilford, Tim
ORCID: 0000-0001-8307-6403
and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2019)
Multi-material heatsink design using level-set topology optimization.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (8).
pp. 1504-1513.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2019.2929017)
finite element analysis
Yin, Chunyan
ORCID: 0000-0003-0298-0420
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Christopher
ORCID: 0000-0002-9438-3879
and Stewart, Paul
(2019)
Thermo-mechanical analysis of conformally coated QFNs for high reliability applications.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11).
pp. 2210-2218.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2019.2925874)
finite element modelling
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Stewart, Paul, Parker, Mike and Roulston, John F.
(2020)
Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3).
pp. 502-515.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2020.2972635)
hot solder dip refinishing process
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Stewart, Paul, Parker, Mike and Roulston, John F.
(2020)
Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3).
pp. 502-515.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2020.2972635)
inkjet printing
Tilford, Tim
ORCID: 0000-0001-8307-6403
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2021)
Comparative reliability of inkjet-printed electronics packaging.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2).
pp. 351-362.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2021.3049952)
level-set method
Santhanakrishnan, Mani sekaran, Tilford, Tim
ORCID: 0000-0001-8307-6403
and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2019)
Multi-material heatsink design using level-set topology optimization.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (8).
pp. 1504-1513.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2019.2929017)
microelectronics
Santhanakrishnan, Mani sekaran, Tilford, Tim
ORCID: 0000-0001-8307-6403
and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2019)
Multi-material heatsink design using level-set topology optimization.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (8).
pp. 1504-1513.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2019.2929017)
microelectronics fabrication
Tilford, Tim
ORCID: 0000-0001-8307-6403
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2021)
Comparative reliability of inkjet-printed electronics packaging.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2).
pp. 351-362.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2021.3049952)
microelectronics packaging
Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim
ORCID: 0000-0001-8307-6403
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Schreier-Alt, Thomas and Warmuth, Jens
(2018)
Reliability testing and stress measurement of QFN
packages encapsulated by an open-ended microwave
curing system.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1).
pp. 173-180.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2018.2859031)
microwave curing
Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim
ORCID: 0000-0001-8307-6403
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Schreier-Alt, Thomas and Warmuth, Jens
(2018)
Reliability testing and stress measurement of QFN
packages encapsulated by an open-ended microwave
curing system.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1).
pp. 173-180.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2018.2859031)
Multiphysics modelling
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Ortiz-Gonzalez, Jose Angel, Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, Chris
ORCID: 0000-0002-9438-3879
and Alatise, Olawiwola
(2017)
A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6).
pp. 893-900.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2017.2688021)
numerical analysis
Tilford, Tim
ORCID: 0000-0001-8307-6403
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2021)
Comparative reliability of inkjet-printed electronics packaging.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2).
pp. 351-362.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2021.3049952)
open-ended oven
Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim
ORCID: 0000-0001-8307-6403
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Schreier-Alt, Thomas and Warmuth, Jens
(2018)
Reliability testing and stress measurement of QFN
packages encapsulated by an open-ended microwave
curing system.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1).
pp. 173-180.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2018.2859031)
packaging
Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T.
ORCID: 0000-0001-8307-6403
, Adamietz, R., Muller, G., Eicher, F. and Bailey, C.
ORCID: 0000-0002-9438-3879
(2012)
Encapsulation of microelectronic components using open-ended microwave oven.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5).
pp. 799-806.
ISSN 2156-3950
(doi:https://doi.org/10.1109/TCPMT.2011.2177524)
Press-Pack assembly
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Ortiz-Gonzalez, Jose Angel, Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, Chris
ORCID: 0000-0002-9438-3879
and Alatise, Olawiwola
(2017)
A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6).
pp. 893-900.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2017.2688021)
QFN
Yin, Chunyan
ORCID: 0000-0003-0298-0420
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Christopher
ORCID: 0000-0002-9438-3879
and Stewart, Paul
(2019)
Thermo-mechanical analysis of conformally coated QFNs for high reliability applications.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11).
pp. 2210-2218.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2019.2925874)
reliability
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Stewart, Paul, Parker, Mike and Roulston, John F.
(2020)
Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3).
pp. 502-515.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2020.2972635)
Tilford, Tim
ORCID: 0000-0001-8307-6403
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2021)
Comparative reliability of inkjet-printed electronics packaging.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2).
pp. 351-362.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2021.3049952)
Yin, Chunyan
ORCID: 0000-0003-0298-0420
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Christopher
ORCID: 0000-0002-9438-3879
and Stewart, Paul
(2019)
Thermo-mechanical analysis of conformally coated QFNs for high reliability applications.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11).
pp. 2210-2218.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2019.2925874)
reliability testing
Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim
ORCID: 0000-0001-8307-6403
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Schreier-Alt, Thomas and Warmuth, Jens
(2018)
Reliability testing and stress measurement of QFN
packages encapsulated by an open-ended microwave
curing system.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1).
pp. 173-180.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2018.2859031)
residual stress
Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim
ORCID: 0000-0001-8307-6403
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Schreier-Alt, Thomas and Warmuth, Jens
(2018)
Reliability testing and stress measurement of QFN
packages encapsulated by an open-ended microwave
curing system.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1).
pp. 173-180.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2018.2859031)
scanning acoustic microscopy
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Stewart, Paul, Parker, Mike and Roulston, John F.
(2020)
Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3).
pp. 502-515.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2020.2972635)
thermal cycling
Yin, Chunyan
ORCID: 0000-0003-0298-0420
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Christopher
ORCID: 0000-0002-9438-3879
and Stewart, Paul
(2019)
Thermo-mechanical analysis of conformally coated QFNs for high reliability applications.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11).
pp. 2210-2218.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2019.2925874)
thermal management
Santhanakrishnan, Mani sekaran, Tilford, Tim
ORCID: 0000-0001-8307-6403
and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2019)
Multi-material heatsink design using level-set topology optimization.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (8).
pp. 1504-1513.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2019.2929017)
tin whiskers
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Stewart, Paul, Parker, Mike and Roulston, John F.
(2020)
Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3).
pp. 502-515.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2020.2972635)
topological optimization
Santhanakrishnan, Mani sekaran, Tilford, Tim
ORCID: 0000-0001-8307-6403
and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2019)
Multi-material heatsink design using level-set topology optimization.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (8).
pp. 1504-1513.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2019.2929017)