D

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2018.2859031)

P

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:10.1109/TCPMT.2011.2177524)

R

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2017.2688021)

S

Santhanakrishnan, Mani sekaran, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2019) Multi-material heatsink design using level-set topology optimization. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (8). pp. 1504-1513. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2019.2929017)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2020.2972635)

T

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2021.3049952)

Y

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical analysis of conformally coated QFNs for high reliability applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11). pp. 2210-2218. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2019.2925874)