Items where Author is "Wheeler, Daniel"
Article
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian
(2002)
Using computer models to identify optimal conditions for flip-chip assembly and reliability.
Circuit World, 28 (1).
pp. 14-20.
ISSN 0305-6120
(doi:10.1108/03056120210696658)
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1999)
An integrated modeling approach to solder joint formation.
IEEE Transactions on Components and Packaging Technology, 22 (4).
pp. 497-502.
ISSN 1521-3331
(doi:10.1109/6144.814964)
Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1998)
Numerical modelling of solder joint formation.
Soldering & Surface Mount Technology, 10 (2).
pp. 6-13.
ISSN 0954-0911
(doi:10.1108/09540919810219912)
Conference Proceedings
Wheeler, Daniel and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879
(1999)
Modelling the melting and solidification of solder material.
In: Advances in Electronic Packaging 1999: Proceedings of the Pacific Rim/Asme International Intersociety Electronic & Photonic Packaging Conference.
American Society of Mechanical Engineers, New York, NY, USA, pp. 397-404.
ISBN 978-0791816127
Conference or Conference Paper
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1997)
Multiphysics modelling of solder joint formation.
In: ASME, EEP - Advances in Electronic Packaging, 15 -19 June 1997, Kohala coast, Hawaii.