Items where Author is "Wheeler, Daniel"
assembly
Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1998)
Numerical modelling of solder joint formation.
Soldering & Surface Mount Technology, 10 (2).
pp. 6-13.
ISSN 0954-0911
(doi:10.1108/09540919810219912)
defects
Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1998)
Numerical modelling of solder joint formation.
Soldering & Surface Mount Technology, 10 (2).
pp. 6-13.
ISSN 0954-0911
(doi:10.1108/09540919810219912)
digital simulation
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1999)
An integrated modeling approach to solder joint formation.
IEEE Transactions on Components and Packaging Technology, 22 (4).
pp. 497-502.
ISSN 1521-3331
(doi:10.1109/6144.814964)
electronic engineering computing
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1999)
An integrated modeling approach to solder joint formation.
IEEE Transactions on Components and Packaging Technology, 22 (4).
pp. 497-502.
ISSN 1521-3331
(doi:10.1109/6144.814964)
flip chip
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian
(2002)
Using computer models to identify optimal conditions for flip-chip assembly and reliability.
Circuit World, 28 (1).
pp. 14-20.
ISSN 0305-6120
(doi:10.1108/03056120210696658)
heat transfer
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1999)
An integrated modeling approach to solder joint formation.
IEEE Transactions on Components and Packaging Technology, 22 (4).
pp. 497-502.
ISSN 1521-3331
(doi:10.1109/6144.814964)
melting
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1999)
An integrated modeling approach to solder joint formation.
IEEE Transactions on Components and Packaging Technology, 22 (4).
pp. 497-502.
ISSN 1521-3331
(doi:10.1109/6144.814964)
modelling
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian
(2002)
Using computer models to identify optimal conditions for flip-chip assembly and reliability.
Circuit World, 28 (1).
pp. 14-20.
ISSN 0305-6120
(doi:10.1108/03056120210696658)
multiphysics modeling
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1999)
An integrated modeling approach to solder joint formation.
IEEE Transactions on Components and Packaging Technology, 22 (4).
pp. 497-502.
ISSN 1521-3331
(doi:10.1109/6144.814964)
numerical modelling
Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1998)
Numerical modelling of solder joint formation.
Soldering & Surface Mount Technology, 10 (2).
pp. 6-13.
ISSN 0954-0911
(doi:10.1108/09540919810219912)
printed circuit boards
Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1998)
Numerical modelling of solder joint formation.
Soldering & Surface Mount Technology, 10 (2).
pp. 6-13.
ISSN 0954-0911
(doi:10.1108/09540919810219912)
printed circuit manufacture
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1999)
An integrated modeling approach to solder joint formation.
IEEE Transactions on Components and Packaging Technology, 22 (4).
pp. 497-502.
ISSN 1521-3331
(doi:10.1109/6144.814964)
reflow
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian
(2002)
Using computer models to identify optimal conditions for flip-chip assembly and reliability.
Circuit World, 28 (1).
pp. 14-20.
ISSN 0305-6120
(doi:10.1108/03056120210696658)
reliability
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian
(2002)
Using computer models to identify optimal conditions for flip-chip assembly and reliability.
Circuit World, 28 (1).
pp. 14-20.
ISSN 0305-6120
(doi:10.1108/03056120210696658)
solder
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1999)
An integrated modeling approach to solder joint formation.
IEEE Transactions on Components and Packaging Technology, 22 (4).
pp. 497-502.
ISSN 1521-3331
(doi:10.1109/6144.814964)
solder joint
Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1998)
Numerical modelling of solder joint formation.
Soldering & Surface Mount Technology, 10 (2).
pp. 6-13.
ISSN 0954-0911
(doi:10.1108/09540919810219912)
solder paste
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian
(2002)
Using computer models to identify optimal conditions for flip-chip assembly and reliability.
Circuit World, 28 (1).
pp. 14-20.
ISSN 0305-6120
(doi:10.1108/03056120210696658)
soldering
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1999)
An integrated modeling approach to solder joint formation.
IEEE Transactions on Components and Packaging Technology, 22 (4).
pp. 497-502.
ISSN 1521-3331
(doi:10.1109/6144.814964)
solders
Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1998)
Numerical modelling of solder joint formation.
Soldering & Surface Mount Technology, 10 (2).
pp. 6-13.
ISSN 0954-0911
(doi:10.1108/09540919810219912)
solidification
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1999)
An integrated modeling approach to solder joint formation.
IEEE Transactions on Components and Packaging Technology, 22 (4).
pp. 497-502.
ISSN 1521-3331
(doi:10.1109/6144.814964)
surface tension
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1999)
An integrated modeling approach to solder joint formation.
IEEE Transactions on Components and Packaging Technology, 22 (4).
pp. 497-502.
ISSN 1521-3331
(doi:10.1109/6144.814964)
thermal stress
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1999)
An integrated modeling approach to solder joint formation.
IEEE Transactions on Components and Packaging Technology, 22 (4).
pp. 497-502.
ISSN 1521-3331
(doi:10.1109/6144.814964)
underfill
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian
(2002)
Using computer models to identify optimal conditions for flip-chip assembly and reliability.
Circuit World, 28 (1).
pp. 14-20.
ISSN 0305-6120
(doi:10.1108/03056120210696658)