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Items where Author is "Wheeler, Daniel"

Items where Author is "Wheeler, Daniel"

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Number of items: 23.

assembly

Bailey, Chris ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1998) Numerical modelling of solder joint formation. Soldering & Surface Mount Technology, 10 (2). pp. 6-13. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540919810219912)

defects

Bailey, Chris ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1998) Numerical modelling of solder joint formation. Soldering & Surface Mount Technology, 10 (2). pp. 6-13. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540919810219912)

digital simulation

Bailey, Christopher ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

electronic engineering computing

Bailey, Christopher ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

flip chip

Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

heat transfer

Bailey, Christopher ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

melting

Bailey, Christopher ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

modelling

Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

multiphysics modeling

Bailey, Christopher ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

numerical modelling

Bailey, Chris ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1998) Numerical modelling of solder joint formation. Soldering & Surface Mount Technology, 10 (2). pp. 6-13. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540919810219912)

printed circuit boards

Bailey, Chris ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1998) Numerical modelling of solder joint formation. Soldering & Surface Mount Technology, 10 (2). pp. 6-13. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540919810219912)

printed circuit manufacture

Bailey, Christopher ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

reflow

Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

reliability

Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

solder

Bailey, Christopher ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

solder joint

Bailey, Chris ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1998) Numerical modelling of solder joint formation. Soldering & Surface Mount Technology, 10 (2). pp. 6-13. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540919810219912)

solder paste

Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

soldering

Bailey, Christopher ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

solders

Bailey, Chris ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1998) Numerical modelling of solder joint formation. Soldering & Surface Mount Technology, 10 (2). pp. 6-13. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540919810219912)

solidification

Bailey, Christopher ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

surface tension

Bailey, Christopher ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

thermal stress

Bailey, Christopher ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

underfill

Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

This list was generated on Mon Sep 21 13:39:04 2020 UTC.