(HSD)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273091)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Alam, M.O., Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:10.1109/ESTC.2012.6542213)

(QFP)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Alam, M.O., Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:10.1109/ESTC.2012.6542213)

analytical models

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:10.1109/ESimE.2012.6191763)

computed tomography

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:10.1109/ESimE.2012.6191763)

conductivity

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:10.1109/ESimE.2012.6191763)

copper

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273091)

electronic components

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Alam, M.O., Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:10.1109/ESTC.2012.6542213)

electronic packaging thermal management

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273091)

failure analysis

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Roulston, John, Stewart, Paul and Tollafield, Peter (2014) Study of impact of thermal refinishing process on reliability of COTS components. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:10.1109/THERMINIC.2014.6972531)

heating

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:10.1109/ESimE.2012.6191763)

hot solder

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:10.1109/ESimE.2012.6191763)

hot solder dip

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273091)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Alam, M.O., Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:10.1109/ESTC.2012.6542213)

hot solder dip process

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Alam, M.O., Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.02.018)

lead

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:10.1109/ESimE.2012.6191763)

leaded components

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273091)

materials

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:10.1109/ESimE.2012.6191763)

microelectronics

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:10.1109/ESimE.2012.6191763)

modelling methodology

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Alam, M.O., Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.02.018)

predictive models

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273091)

Quad Flat Package

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Alam, M.O., Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:10.1109/ESTC.2012.6542213)

reliability

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Roulston, John, Stewart, Paul and Tollafield, Peter (2014) Study of impact of thermal refinishing process on reliability of COTS components. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:10.1109/THERMINIC.2014.6972531)

solders

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Roulston, John, Stewart, Paul and Tollafield, Peter (2014) Study of impact of thermal refinishing process on reliability of COTS components. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:10.1109/THERMINIC.2014.6972531)

stress

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273091)

thermal analysis

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Alam, M.O., Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.02.018)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:10.1109/ESimE.2012.6191763)

thermal management (packaging)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Roulston, John, Stewart, Paul and Tollafield, Peter (2014) Study of impact of thermal refinishing process on reliability of COTS components. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:10.1109/THERMINIC.2014.6972531)

thermal modelling

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:10.1109/ESimE.2012.6191763)

thermal stresses

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273091)

thermomechanical processes

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273091)

tin alloys

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Roulston, John, Stewart, Paul and Tollafield, Peter (2014) Study of impact of thermal refinishing process on reliability of COTS components. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:10.1109/THERMINIC.2014.6972531)

tin whiskers

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Alam, M.O., Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.02.018)

whiskers (crystal)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Roulston, John, Stewart, Paul and Tollafield, Peter (2014) Study of impact of thermal refinishing process on reliability of COTS components. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:10.1109/THERMINIC.2014.6972531)

wires

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273091)