Items where Author is "Strusevitch, Nadia"

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Number of items: 40.

agitation method

Kaufmann, Jens Georg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-009-0886-2)

circuits

Richardson, Andrew, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:10.1108/03056120710723706)

copper

Design for Reliability modelling

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684364)

electrodeposition

Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684530)

Strusevitch, Nadia, Hughes, Michael, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Djambazov, Georgi (2008) Numerical modelling of electrodeposition phenomena. 2nd Electronics System-Integration Technology Conference, Greenwich, UK, 1-4 September 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 281-286. ISBN 978-1-4244-2813-7 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684362)

electromagnetic field

Hughes, Michael, Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 and Strusevitch, Nadia (2002) Modelling the fluid dynamics and coupled phenomena in arc weld pools. In: Mathematical Modelling of Weld Phenomena. Materials Modelling, 6 . Maney Publishing for the Institute of Materials, Minerals and Mining, London, England, UK, pp. 63-81. ISBN 9781902653563

electromechanical devices

electronics industry

electroplating

Finite Element Analysis (FEA)

flow behaviour

heat transfer

high density interconnection technology

megasonic acoustic streaming

megasonic agitation

metals

microvias

non-linear transient finite element simulations

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432818)

numerical modelling

Strusevitch, Nadia, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Liu, D., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:10.1109/EPTC.2006.342703)

NXP

package design parameters

packaging design

plating rate

reduced order models (ROM)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Yannou, J.-M., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Strusevitch, Nadia (2007) Reliability based design optimisation for system-in-package. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 289-296. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359948)