Items where Author is "Stoyanov, S."

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3D printing accelerated temperature cycle Additive manufacturing adhesive bonding adhesives aerospace Analytical models ball grid arrays butterfly module CFD chip scale packaging commercial off-the shelf components composite compuational fluid dynamics (CFD) computational computational fluid dynamics computational mechanics computational modelling computer aided analysis computer modelling computer simulation conducting materials conservation curing Cutty Sark data analysis data driven prognostics data-driven prognostics delamination design design methodology Design of Experiment (DoE) method Designers electronic components electronic packages Electronic Packaging electronics manufacturing embedded die engineering computing fatigue life-time fatigue of materials FEA fine-pitch technology finite element analysis Finite Element Analysis (FEA) five process parameters flip chip flip chip devices flip-chip assembly flip-chip devices flow Fluids focused ion beam Focused Ion Beam (FIB) method gas flow Generative manufacturing Graphics processing units historic integrated circuit interconnections integrated circuit reliability Integrated Design of Experiments (DoE) interfaces (materials) Kernel lead free solder interconnects LED displays LEDs life testing light emitting diodes machine learning manufacturing technicians material deformation Materials Materials scientist Mechanical engineering methodology micro and nano system micro-machining process microassembling microelectronic processing Microelectronics modelling Monte Carlo simulation Multi-physics modeling nitrogen no-flow underfill materials Numerical models Numerical Optimilation numerical optimisation numerical optimization material properties optimisation optimization organic light emitting diodes oxygen packaging particle swarm optimisation algorithm PHM pigtail fibre optic post weld stresses printing probabilities Product developers Production technicians Production technology prognostics framework prognostics health management qualification testing quality Reduced Order Models (ROM) refinishing reliability reliable electronic packaging Response Surface response surface methodology scanning acoustic microscopes semiconductor device packaging semiconductor device reliability ship side-by-side dies SiP technology soldered joints solders solders thermal stress cracking stacked die structure surface mount technology Surface tension Thermal Management thermal management (packaging) thermo-mechanical reliability analysis uncertainty analysis underfill warpage wave soldering X ray microscopes

Number of items: 161.

3D printing

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

accelerated temperature cycle

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

Additive manufacturing

adhesive bonding

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

adhesives

aerospace

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Mackay, W., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

Analytical models

Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Tourloukis, G. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-7. ISBN 978-1-5090-2106-2 (doi:10.1109/EuroSimE.2016.7463358)

ball grid arrays

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 (2004) Reliability predictions for high density packaging. In: Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., U.S.A., pp. 121-128. ISBN 0780386205 (doi:10.1109/HPD.2004.1346684)

butterfly module

Mallik, A., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Firth, P. (2009) Design for reliability methodology for micro laser welding of pigtail fibres. In: Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4244-4161-7 (electronic), 978-1-4244-4160-0 (print) (doi:10.1109/ESIME.2009.4938409)

CFD

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Saxena, N. and Adams, S. (2005) Optimising the wave soldering process for lead free solders. In: Proceeding of 2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability - (2005 AGEC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 125-128. ISBN 0780388062 (doi:10.1109/AGEC.2005.1452331)

chip scale packaging

commercial off-the shelf components

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.07.030)

composite

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Mason, P. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2006) Computational methodology for analysis of historic composite structures. In: Proceedings of the 5th International Conference on Engineering Computational Technology. Civil-Comp Press, Stirlingshire, UK. ISBN 1905088116 ISSN 1759-3433 (doi:10.4203/ccp.84.132)

compuational fluid dynamics (CFD)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Saxena, N. and Adams, S. (2004) Modelling the wave soldering process. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 553-558. ISBN 983251486X

computational

computational fluid dynamics

computational mechanics

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 and Cross, M. (2002) Integrated computational mechanics and optimization for design of electronic components. In: Parmee, Ian C. and Hajela, Prabhat, (eds.) Optimization In Industry. Springer Verlag, pp. 57-71. ISBN 9781852338342

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2001) Integrating computational mechanics and numerical optimization for the design of material properties in electronic packages. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 551-562. ISBN 0873395131

computational modelling

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Tang, Y.K., Marson, S., Dyer, A., Allen, D. and Desmulliez, M. (2010) Computational modelling and optimisation of the fabrication of nano-structures using focused ion beam and imprint forming technologies. Journal of Physics: Conference Series (JPCS), 253 (1):012008. ISSN 1742-6588 (Print), 1742-6596 (Online) (doi:10.1088/1742-6596/252/1/012008)

computer aided analysis

computer modelling

Rosunally, Y.Z., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Mason, P., Campbell, S., Monger, G. and Bell, I. (2011) Fusion approach for prognostics framework of heritage structure. IEEE Transactions on Reliability, 60 (1):570453. pp. 3-13. ISSN 0018-9529 (doi:10.1109/TR.2011.2104451)

computer simulation

Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

conducting materials

conservation

curing

Cutty Sark

data analysis

Ahsan, M., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Albarbar, A. (2020) Developing computational intelligence for smart qualification testing of electronic products. IEEE Access, 8. pp. 16922-16933. ISSN 2169-3536 (Online) (doi:10.1109/ACCESS.2020.2967858)

data driven prognostics

Sutharssan, T., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Rosunally, Y. (2012) Data analysis techniques for real-time prognostics and health management of semiconductor devices. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4673-0694-2 (print)

data-driven prognostics

delamination

design

design methodology

Tang, Ying Kit, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:10.1109/ESTC.2008.4684478)

Design of Experiment (DoE) method

Designers

electronic components

electronic packages

Electronic Packaging

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2002) Response Surface Modeling and Optimisation for Reliable Electronic Products. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 49-57. ISBN 0780398238

electronics manufacturing

embedded die

engineering computing

fatigue life-time

fatigue of materials

FEA

fine-pitch technology

finite element analysis

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2003) Optimization and finite element analysis for reliable electronic packaging. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-399. ISBN 0780370546

Finite Element Analysis (FEA)

five process parameters

flip chip

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2002) Optimisation modelling for flip-chip solder joint reliability. Soldering and Surface Mount Technology, 14 (1). pp. 49-58. ISSN 0954-0911 (doi:10.1108/09540910210416477)

flip chip devices

flip-chip assembly

Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

flip-chip devices

flow

Fluids

focused ion beam

Tang, Y.K., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2008) Optimisation methodology for risk mitigation in advanced micro-system electronics manufacturing. In: EngOpt 2008 - International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7