Items where Author is "Scott, Jim"
(HSD)
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:10.1109/ISSE.2012.6273091)
analytical models
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John
(2012)
Thermal modelling and optimisation of hot solder dip process.
In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012).
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA.
ISBN 978-1-4673-1512-8
(doi:10.1109/ESimE.2012.6191763)
computed tomography
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John
(2012)
Thermal modelling and optimisation of hot solder dip process.
In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012).
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA.
ISBN 978-1-4673-1512-8
(doi:10.1109/ESimE.2012.6191763)
conductivity
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John
(2012)
Thermal modelling and optimisation of hot solder dip process.
In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012).
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA.
ISBN 978-1-4673-1512-8
(doi:10.1109/ESimE.2012.6191763)
copper
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:10.1109/ISSE.2012.6273091)
electronic packaging thermal management
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:10.1109/ISSE.2012.6273091)
heating
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John
(2012)
Thermal modelling and optimisation of hot solder dip process.
In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012).
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA.
ISBN 978-1-4673-1512-8
(doi:10.1109/ESimE.2012.6191763)
hot solder
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John
(2012)
Thermal modelling and optimisation of hot solder dip process.
In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012).
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA.
ISBN 978-1-4673-1512-8
(doi:10.1109/ESimE.2012.6191763)
hot solder dip
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:10.1109/ISSE.2012.6273091)
hot solder dip process
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879, Alam, M.O., Yin, Chunyan
ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim
(2013)
Modelling methodology for thermal analysis of hot solder dip process.
Microelectronics Reliability, 53 (8).
pp. 1055-1067.
ISSN 0026-2714
(doi:10.1016/j.microrel.2013.02.018)
lead
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John
(2012)
Thermal modelling and optimisation of hot solder dip process.
In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012).
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA.
ISBN 978-1-4673-1512-8
(doi:10.1109/ESimE.2012.6191763)
leaded components
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:10.1109/ISSE.2012.6273091)
materials
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John
(2012)
Thermal modelling and optimisation of hot solder dip process.
In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012).
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA.
ISBN 978-1-4673-1512-8
(doi:10.1109/ESimE.2012.6191763)
microelectronics
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John
(2012)
Thermal modelling and optimisation of hot solder dip process.
In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012).
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA.
ISBN 978-1-4673-1512-8
(doi:10.1109/ESimE.2012.6191763)
modelling methodology
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879, Alam, M.O., Yin, Chunyan
ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim
(2013)
Modelling methodology for thermal analysis of hot solder dip process.
Microelectronics Reliability, 53 (8).
pp. 1055-1067.
ISSN 0026-2714
(doi:10.1016/j.microrel.2013.02.018)
predictive models
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:10.1109/ISSE.2012.6273091)
stress
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:10.1109/ISSE.2012.6273091)
thermal analysis
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879, Alam, M.O., Yin, Chunyan
ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim
(2013)
Modelling methodology for thermal analysis of hot solder dip process.
Microelectronics Reliability, 53 (8).
pp. 1055-1067.
ISSN 0026-2714
(doi:10.1016/j.microrel.2013.02.018)
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John
(2012)
Thermal modelling and optimisation of hot solder dip process.
In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012).
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA.
ISBN 978-1-4673-1512-8
(doi:10.1109/ESimE.2012.6191763)
thermal modelling
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John
(2012)
Thermal modelling and optimisation of hot solder dip process.
In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012).
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA.
ISBN 978-1-4673-1512-8
(doi:10.1109/ESimE.2012.6191763)
thermal stresses
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:10.1109/ISSE.2012.6273091)
thermomechanical processes
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:10.1109/ISSE.2012.6273091)
tin whiskers
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879, Alam, M.O., Yin, Chunyan
ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim
(2013)
Modelling methodology for thermal analysis of hot solder dip process.
Microelectronics Reliability, 53 (8).
pp. 1055-1067.
ISSN 0026-2714
(doi:10.1016/j.microrel.2013.02.018)
wires
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:10.1109/ISSE.2012.6273091)