Items where Author is "Rajaguru, Pushparajah"

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abrasion Artificial Intelligence beam finite element buckling failure corrosion Damage Damage rule degradation digital twin Electronic Packaging Fatigue finite element method Finite Element Method (FEM) heat sink Kriging level-set method life expectancy life prediction longitudinal bending machine learning Medway Queen microsystems Model order reduction Model Order Reduction (MOR) modelling Multiphysics modelling N/A neural nets Offshore renewable energy optimisation parametric model order reduction parametric Model Order Reduction (pMOR) Particle Swarm Optimisation power electronic module power electronics module Power Electronics Module (PEM) Power module power modules Press-Pack Press-Pack assembly probabilistic optimisation prognostics radial basis reduced order models Reliability reliability assessment risk analysis robotics ROMARA software scour Silicon Carbide smart manufacturing Solder joint Subsea cables sustainability thermal diffusivity thermal-mechanical analysis topology optimization wear wirebond

Number of items: 89.

abrasion

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

Artificial Intelligence

Malik, Asif, Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Azzawi, Rula (2022) Smart manufacturing with Artificial Intelligence and digital twin: a brief review. In: 8th International Conference on Information Technology Trends, 25th - 26th May 2022, Dubai, UAE.

beam finite element

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Mason, Peter, Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2014) Buckling analysis on the hull of the historic paddle steamer ‘Medway Queen’. Ships and Offshore Structures, 9 (6). pp. 643-654. ISSN 1744-5302 (Print), 1754-212X (Online) (doi:https://doi.org/10.1080/17445302.2013.849065)

buckling failure

corrosion

Damage

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

Damage rule

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-014-0054-5)

degradation

digital twin

Electronic Packaging

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2017.2688021)

Fatigue

finite element method

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:https://doi.org/10.23919/EMPC55870.2023.10418328)

Finite Element Method (FEM)

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2024) Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Electronics System-Integration Technology Conference, ESTC . Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey, pp. 1-8. ISBN 979-8350390360 ISSN 2687-9700 (Print), 2687-9727 (Online) (doi:https://doi.org/10.1109/ESTC60143.2024.10712079)

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris and Tilford, Timothy ORCID: 0000-0001-8307-6403 (2024) Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction. Power Electronic Devices and Components:100063. ISSN 2772-3704 (Online) (doi:https://doi.org/10.1016/j.pedc.2024.100063)

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE57496.2023.10168468)

heat sink

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Santhanakrishnan, Manisekaran, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2019) Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE. ISBN 978-1728120782 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2019.8923530)

Kriging

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:https://doi.org/10.1016/j.ijfatigue.2012.06.013)

level-set method

life expectancy

life prediction

longitudinal bending

machine learning

Medway Queen

microsystems

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules. PhD thesis, University of Greenwich.

Model order reduction

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Bella, Martina (2021) Applying model order reduction to the reliability prediction of power electronic module wire bond structure. In: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, Piscataway, US. ISBN 978-1665418973 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC52472.2021.9626396)

Model Order Reduction (MOR)

modelling

Multiphysics modelling

N/A

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Mason, Peter, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) Structural Analysis on the Riveted Hull of the Paddle Steamer Medway Queen. In: Historic Ships Conference 2012. Royal Institution of Naval Architects (RINA).

neural nets

Offshore renewable energy

optimisation

parametric model order reduction

parametric Model Order Reduction (pMOR)

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE57496.2023.10168468)

Particle Swarm Optimisation

power electronic module

Hua, Lu, Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) A numerical procedure for the optimization of IGBT module packaging. In: 2018 19th International Conference on Electronic Packaging Technology (ICEPT). 08-11 August 2018. Shanghai, China. IEEE Xplore (CFP 18553-ART) (18553). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 156-160. ISBN 978-1538663868; 978-1538663851; 978-1538663875 (doi:https://doi.org/10.1109/ICEPT.2018.8480746)

power electronics module

Power Electronics Module (PEM)

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE57496.2023.10168468)

Power module

power modules

Press-Pack

Ortiz Gonzalez, Jose, Alatise, Olayiwola, Aliyu, Attahir, Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Castellazzi, Alberto, Ran, Li, Mawby, Philip and Bailey, Chris ORCID: 0000-0002-9438-3879 (2017) Evaluation of SiC Schottky diodes using pressure contacts. IEEE Transactions on Industrial Electronics, 64 (10). 8213 -8223. ISSN 0278-0046 (Print), 1557-9948 (Online) (doi:https://doi.org/10.1109/TIE.2017.2677348)

Press-Pack assembly

probabilistic optimisation

prognostics

radial basis

reduced order models

Reliability

reliability assessment

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE57496.2023.10168468)

risk analysis

robotics

ROMARA software

scour

Silicon Carbide

smart manufacturing

Solder joint

Subsea cables

sustainability

thermal diffusivity

thermal-mechanical analysis

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE57496.2023.10168468)

topology optimization

wear

wirebond

This list was generated on Mon Nov 25 14:03:08 2024 UTC.

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