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Items where Author is "Rajaguru, Pushparajah"

Items where Author is "Rajaguru, Pushparajah"

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Number of items: 19.

Article

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris and Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403 (2024) Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction. Power Electronic Devices and Components:100063. ISSN 2772-3704 (Online) (doi:10.1016/j.pedc.2024.100063)

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:10.1109/ACCESS.2019.2911260)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2017.2688021)

Ortiz Gonzalez, Jose, Alatise, Olayiwola, Aliyu, Attahir, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Castellazzi, Alberto, Ran, Li, Mawby, Philip and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2017) Evaluation of SiC Schottky diodes using pressure contacts. IEEE Transactions on Industrial Electronics, 64 (10). 8213 -8223. ISSN 0278-0046 (Print), 1557-9948 (Online) (doi:10.1109/TIE.2017.2677348)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.07.047)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.03.011)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Mason, Peter, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2014) Buckling analysis on the hull of the historic paddle steamer ‘Medway Queen’. Ships and Offshore Structures, 9 (6). pp. 643-654. ISSN 1744-5302 (Print), 1754-212X (Online) (doi:10.1080/17445302.2013.849065)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-014-0054-5)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.4024056)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:10.1016/j.ijfatigue.2012.06.013)

Conference Proceedings

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2024) Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Electronics System-Integration Technology Conference, ESTC . Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey, pp. 1-8. ISBN 979-8350390360 ISSN 2687-9700 (Print), 2687-9727 (Online) (doi:10.1109/ESTC60143.2024.10712079)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:10.23919/EMPC55870.2023.10418328)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:10.1109/ISSE57496.2023.10168468)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Bella, Martina (2021) Applying model order reduction to the reliability prediction of power electronic module wire bond structure. In: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, Piscataway, US. ISBN 978-1665418973 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:10.1109/THERMINIC52472.2021.9626396)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Santhanakrishnan, Manisekaran, Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2019) Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE. ISBN 978-1728120782 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:10.1109/THERMINIC.2019.8923530)

Hua, Lu, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) A numerical procedure for the optimization of IGBT module packaging. In: 2018 19th International Conference on Electronic Packaging Technology (ICEPT). 08-11 August 2018. Shanghai, China. IEEE Xplore (CFP 18553-ART) (18553). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 156-160. ISBN 978-1538663868; 978-1538663851; 978-1538663875 (doi:10.1109/ICEPT.2018.8480746)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Mason, Peter, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2012) Structural Analysis on the Riveted Hull of the Paddle Steamer Medway Queen. In: Historic Ships Conference 2012. Royal Institution of Naval Architects (RINA).

Conference or Conference Paper

Malik, Asif, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Azzawi, Rula (2022) Smart manufacturing with Artificial Intelligence and digital twin: a brief review. In: 8th International Conference on Information Technology Trends, 25th - 26th May 2022, Dubai, UAE.

Thesis

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules. PhD thesis, University of Greenwich.

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