LED

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC). THERMINIC, pp. 1-5.

UNDERFILL

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC). THERMINIC, pp. 1-5.