Items where Author is "Mitcheson, P. D."
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Conference Proceedings
Rajaguru, P.
ORCID: 0000-0002-6041-0517
, Bailey, C.
ORCID: 0000-0002-9438-3879
, Lu, H.
ORCID: 0000-0002-4392-6562
, Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T.
(2017)
Co-design/simulation of flip-chip assembly for high voltage IGBT packages.
In: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC).
THERMINIC, pp. 1-5.