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Items where Author is "Ling, Yuxiao"

Items where Author is "Ling, Yuxiao"

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Group by: Item Type | Uncontrolled Keywords | No Grouping
Microelectronics Solder thermal interface materials Thermal resistance Three-dimensional Virtual testing Void morphology
Number of items: 6.

Microelectronics

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)

Solder thermal interface materials

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)

Thermal resistance

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)

Three-dimensional

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)

Virtual testing

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)

Void morphology

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)

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