Items where Author is "Ling, Yuxiao"
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Article
Okereke, Michael I.
ORCID: 0000-0002-2104-012X
and Ling, Yuxiao
(2018)
A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials.
Applied Thermal Engineering, 142.
pp. 346-360.
ISSN 1359-4311 (Print), 1873-5606 (Online)
(doi:https://doi.org/10.1016/j.applthermaleng.2018.07.002)