Article

Okereke, Michael I. ORCID: 0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:https://doi.org/10.1016/j.applthermaleng.2018.07.002)