Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Adamietz, R., Pavuluri, S. K., Desmulliez, M. P. Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 262-267. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184428)

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:10.1109/TCPMT.2011.2177524)

Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Experimental investigation of open-ended microwave oven assisted encapsulation process. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-8553-6 (print), 978-1-4244-8554-3 (online) (doi:10.1109/ESTC.2010.5643015)

Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642822)

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642820)

Adamietz, R., Müller, G., Othman, N., Eicher, F., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Pavuluri, S.K., Desmulliez, M. P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) On the integration of microwave curing systems into microelectronics assembly processes. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642827)

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:10.1109/ISSE.2010.5547360)

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

Tilford, T., Ferenets, M., Morris, J., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Evaluation of polymer cure models in microelectronics packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:10.1260/1748-3018.4.1.121)

Adamietz, R., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Desmulliez, M.P.Y., Muller, G., Othman, N and Eicher, F. (2010) Modular microwave-based system for packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

Ferenets, M., Tilford, Tim, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) Microwave curing of thermosetting polymer materials in microelectronics applications. In: Baltic Polymer Symposium 2009, 22-25 September 2009, Ventspils, Latvia.

Morris, James E., Tilford, Tim, Ferenets, M. and Bailey, Christopher (2009) A critical analysis of polymer cure modeling for microelectronics applications. In: IMAPS Nordic Conference 2009, 13-15 September 2009, Tønsberg, Norway.