Items where Author is "Alatise, O."
Article
Rajaguru, P. ORCID: https://orcid.org/0000-0002-6041-0517, Lu, H.
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O.
(2016)
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective.
Microelectronics Reliability, 68.
pp. 77-85.
ISSN 0026-2714
(doi:10.1016/j.microrel.2016.12.002)
Conference Proceedings
Rajaguru, P. ORCID: https://orcid.org/0000-0002-6041-0517, Lu, H.
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O.
(2016)
Electro-thermo-mechanical modelling and analysis of
the Press Pack Diode in Power Electronics.
In: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
IEEE, pp. 1-6.
ISBN 978-1-4673-9706-3
(doi:10.1109/THERMINIC.2015.7389607)