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Items where Greenwich Author is "Mallik, Sabuj"

Items where Greenwich Author is "Mallik, Sabuj"

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Jump to: Reliability, Solder joint, Shear strength, Fractures. | SMT solder joints, Shear strength, PCB, Reflow process, Isothermal ageing, FESEM, EDX, Intermetallic compounds (IC) | Solder paste, Flip chip packaging, Rheology, Stencil printing, Viscosity | Voiding, Soldering, X-ray, Lead Free Solder Paste | Wall-slip, solder paste, rheology, isotropic conductive adhesives, stencil printing process | adhesives, elastic and plastic behaviour, non-destructive testing, NDT | advanced characterization, electronic materials, modeling processes, | alloy, electronic materials, bonding, soldering, scanning electron microscopy (SEM) | ball grid array, ductile and brittle fractures, isothermal ageing, lead free solder alloy, shear strength, solder joint | chip scale package (CSP) technology, solder thermal interface materials (STIMs), out-gassing phenomenon, defective metallisation, finite element analysis (FEA) | chip-scale packaged power device, automotive applications, solder thermal interface materials (STIMs), three-dimensional finite element analysis, lead-free solder | electronic control unit, thermal management, metal matrix composites, thermal conductive polymer, thermal interface material | fatigue failure, finite element analysis, life prediction, thermal fatigue | high temperature electronics, solder joint reliability, surface mount components, thermal cycling, fatigue failure | intermetallic compounds, Sn-Ag-Cu, solder, shear strength | lead-free solder paste, rheology, stencil printing | lead-free soldering | lead-free soldering, new solder paste formulation, flip chip assembly, ultra-fine pitch assembly, wall-slip, creep-recovery, rheological characterisation, | linear visco-elastic, solder paste, isotropic conductive adhesives, flip-chip, rheology, lead-free, | metal matrix composites, thermal management, thermal interface material | microelectronics, thermal efficiency, heat sink geometry, aluminium, copper | nonlinear flow, rheology, suspension, solder paste, viscoelasticity | reflow parameters, shear strength, normal probability plot, solder joint, chip resistors | rheological behaviours, solder pastes, flux, metallurgy, flip-chip assembly, | rheology, solder paste, thixotropy, printing | solder paste, flux, creep, viscosity, quality control, rheology | solder pastes, isotropic conductive adhesives, rheology, thixotropy, viscosity | solders, thermal interface materials, fatigue, lead-free | stencil printing, solder paste, design of experiments | thermal constriction, micro-contact, micro-gap, chip, heat sink | thermal management materials, heat sink, thermal conductivity, coefficient of thermal expansion, density, cost, Al/SiC | thermal management, electronic control unit, materials, processing technology | thermal, interface, automotive, electronic unit | under-hood automotive ambient, electronic control unit (ECU), Euro 6 standard, thermal interface materials (TIMs), nanotechnology, carbon nanotubes (CNTs), carbon nanofibres (CNFs), chemical vapour deposition (CVD) | wall-slip behavior, solder pastes, isotropic conductive adhesives | wall-slip effects, solder pastes, electronics assembly applications
Number of items: 36.

Reliability, Solder joint, Shear strength, Fractures.

Mallik, Sabuj and Kaiser, Franziska (2014) Reliability study of subsea electronic systems subjected to accelerated thermal cycle ageing. In: Proceedings of The World Congress on Engineering 2014. Newswood Limited, Hong Kong, pp. 1436-1440. ISBN 978-988-19253-5-0 ISSN 2078-0958 (Print), 2078-0966 (Online)

SMT solder joints, Shear strength, PCB, Reflow process, Isothermal ageing, FESEM, EDX, Intermetallic compounds (IC)

Nath, Jyotishman, Mallik, Sabuj and Bora, Anil (2015) A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints. Journal of The Institution of Engineers (India): Series D Metallurgical & Materials and Mining Engineering, 96 (1). pp. 1-6. ISSN 2250-2122 (Print), 2250-2130 (Online) (doi:https://doi.org/10.1007/s40033-014-0063-3)

Solder paste, Flip chip packaging, Rheology, Stencil printing, Viscosity

Sharma, Ashutosh, Mallik, Sabuj, Ekere, N. and Jung, Jae-Pil (2014) Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes. Journal of the Microelectronics and Packaging Society, 21 (4). pp. 1-13. ISSN 1226-9360 (Print), 2287-7525 (Online) (doi:https://doi.org/10.6117/kmeps.2014.21.4.001)

Voiding, Soldering, X-ray, Lead Free Solder Paste

Mallik, Sabuj, Njoku, Jude and Takyi, Gabriel (2015) Quantitative evaluation of voids in lead free solder joints. Applied Mechanics and Materials, 772. pp. 284-289. ISSN 1660-9336

Wall-slip, solder paste, rheology, isotropic conductive adhesives, stencil printing process

Durairaj, R., Mallik, S., Seman, A. and Ekere, N.N. (2009) Investigation of wall-slip behaviour in lead-free solder pastes and isotropic conductive adhesives. Sadhana - Academy Proceedings in Engineering Sciences, 34 (5). pp. 799-810. ISSN 0256-2499 (Print), 0973-7677 (Online) (doi:https://doi.org/10.1007/s12046-009-0046-5)

adhesives, elastic and plastic behaviour, non-destructive testing, NDT

Amalu, Emeka H., Ekere, Ndy and Mallik, Sabuj (2011) Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process. Materials and Design, 32 (6). pp. 3189-3197. ISSN 0261-3069 (doi:https://doi.org/10.1016/j.matdes.2011.02.045)

advanced characterization, electronic materials, modeling processes,

Mallik, S., Ekere, N.N., Marks, A.E., Seman, A. and Durairaj, R. (2010) Modeling the structural breakdown of solder paste using the structural kinetic model. Journal of Materials Engineering and Performance, 19 (1). pp. 40-45. ISSN 1059-9495 (Print), 1544-1024 (Online) (doi:https://doi.org/10.1007/s11665-009-9448-0)

alloy, electronic materials, bonding, soldering, scanning electron microscopy (SEM)

Kumar, Santosh, Mallik, Sabuj, Ekere, Ndy and Jung, Jaepil (2013) Stencil Printing Behavior of Lead-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100 μm Size Solder Bumps. Metals and Materials International, 19 (5). pp. 1083-1090. ISSN 1598-9623 (Print), 2005-4149 (Online) (doi:https://doi.org/10.1007/s12540-013-5025-z)

ball grid array, ductile and brittle fractures, isothermal ageing, lead free solder alloy, shear strength, solder joint

Mallik, Sabuj and Mehdawi, Ahmed Z. El (2014) Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing. In: Yang, Gi-Chul, Ao, Sio-Iong and Gelman, Len, (eds.) Transactions on Engineering Technologies. Special Volume of the World Congress on Engineering 2013. Springer Netherlands, pp. 31-41. ISBN 9789401788311 (doi:https://doi.org/10.1007/978-94-017-8832-8_3)

chip scale package (CSP) technology, solder thermal interface materials (STIMs), out-gassing phenomenon, defective metallisation, finite element analysis (FEA)

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)

chip-scale packaged power device, automotive applications, solder thermal interface materials (STIMs), three-dimensional finite element analysis, lead-free solder

Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Mallik, S., Amalu, E.H. and Ekpu, M. (2011) Thermal effects of die-attach voids location and style on performance of chip level package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 231-236. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145176)

electronic control unit, thermal management, metal matrix composites, thermal conductive polymer, thermal interface material

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:https://doi.org/10.1016/j.applthermaleng.2010.09.023)

fatigue failure, finite element analysis, life prediction, thermal fatigue

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S. and Ekpu, M. (2012) Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach. Engineering Failure Analysis, 28. pp. 192-207. ISSN 1350-6307 (doi:https://doi.org/10.1016/j.engfailanal.2012.10.008)

high temperature electronics, solder joint reliability, surface mount components, thermal cycling, fatigue failure

Amalu, E.H., Ekere, N.N., Bhatti, R.S., Mallik, S., Takyi, G. and Ibhadode, A.O.A. (2011) Numerical investigation of thermo-mechanical behaviour of ball grid array solder joint at high temperature excursion. Advanced Materials Research, 367. pp. 287-292. ISSN 1662-8985 (Print), 1022-6680 (Online) (doi:https://doi.org/10.4028/www.scientific.net/AMR.367.287)

intermetallic compounds, Sn-Ag-Cu, solder, shear strength

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2015) Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology, 27 (1). pp. 52-58. ISSN 0954-0911 (doi:https://doi.org/10.1108/SSMT-07-2013-0019)

lead-free solder paste, rheology, stencil printing

Durairaj, R., Ramesh, S., Mallik, S., Seman, A. and Ekere, N. (2009) Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes. Materials and Design, 30 (9). pp. 3812-3818. ISSN 0261-3069 (doi:https://doi.org/10.1016/j.matdes.2009.01.028)

lead-free soldering

Bernasko, P.K., Mallik, S., Ekere, N.N., Seman, A. and Tayki, G. (2010) Effect of reflow profile and thermal cycle ageing on the intermetallic formation and growth in lead-free soldering. In: Electronics Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 986-990. ISBN 978-1-4244-5100-5 (electronic), 978-1-4244-5099-2 (print) (doi:https://doi.org/10.1109/EPTC.2009.5416398)

lead-free soldering, new solder paste formulation, flip chip assembly, ultra-fine pitch assembly, wall-slip, creep-recovery, rheological characterisation,

Ekere, N and Mallik, Sabuj (2008) A methodology for characterising new lead-free solder paste formulations used for flip-chip assembly applications. In: Kobayashi, Akira, (ed.) Smart processing technology: SPT '07. High Temperature Society of Japan, Ibaraki, Japan, pp. 59-64.

linear visco-elastic, solder paste, isotropic conductive adhesives, flip-chip, rheology, lead-free,

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2008.09.013)

metal matrix composites, thermal management, thermal interface material

Mallik, S. and Ekere, N. (2013) Metal matrix composites as thermal management materials for automotive applications. In: Magagnin, Luca, (ed.) Engineered Metal Matrix Composites: Forming Methods, Material Properties and Industrial Applications. Nova Science Publishers, Inc., New York, USA, pp. 113-126. ISBN 9781620817193

microelectronics, thermal efficiency, heat sink geometry, aluminium, copper

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145164)

nonlinear flow, rheology, suspension, solder paste, viscoelasticity

Mallik, Sabuj, Chan, Erica Hiu Laam and Ekere, Ndy (2012) Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications. Journal of Materials Engineering and Performance, 22 (4). pp. 1186-1193. ISSN 1059-9495 (Print), 1544-1024 (Online) (doi:https://doi.org/10.1007/s11665-012-0360-7)

reflow parameters, shear strength, normal probability plot, solder joint, chip resistors

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2014) Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength. International Journal of Materials Science and Applications, 3 (5). pp. 254-259. ISSN 2327-2635 (Print), 2327-2643 (Online) (doi:https://doi.org/10.11648/j.ijmsa.20140305.27)

rheological behaviours, solder pastes, flux, metallurgy, flip-chip assembly,

Mallik, Sabuj (2009) Study of the time-dependent rheological behaviour of lead-free solder pastes and flux mediums used for flip-chip assembly applications. PhD thesis, University of Greenwich.

rheology, solder paste, thixotropy, printing

Mallik, Sabuj (2010) Rheological characterisation and modelling of electronic materials: time-dependent behaviours of lead-free solder pastes and flux mediums. LAP Lambert Academic Publishing GmbH & Co. KG, Saarbrücken, Germany. ISBN 978-3-8433-7771-3

solder paste, flux, creep, viscosity, quality control, rheology

Durairaj, Rajkumar, Mallik, Sabuj and Ekere, Ndy (2008) Solder paste characterisation: towards the development of quality control (QC) tool. Soldering & Surface Mount Technology, 20 (3). pp. 34-40. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910810885705)

solder pastes, isotropic conductive adhesives, rheology, thixotropy, viscosity

Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)

solders, thermal interface materials, fatigue, lead-free

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

stencil printing, solder paste, design of experiments

Mallik, Sabuj and Ekere, Ndy (2011) Investigating the effects of area ratio and aspect ratio on stencil printing process used in the electronics assembly line. In: International Conference on Electronics Packaging (ICEP) 2011, 13-15 April 2011, Nara Prefectural New Public Hall, Nara, Japan.

thermal constriction, micro-contact, micro-gap, chip, heat sink

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID: 0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2013.10.011)

thermal management materials, heat sink, thermal conductivity, coefficient of thermal expansion, density, cost, Al/SiC

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

thermal management, electronic control unit, materials, processing technology

Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2012) Thermal management materials for electronic control unit: trends, processing technology and R and D challenges. Advanced Materials Research, 367. pp. 301-307. ISSN 1022-6680 (Print), 1662-8985 (Online) (doi:https://doi.org/10.4028/www.scientific.net/AMR.367.301)

thermal, interface, automotive, electronic unit

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)

under-hood automotive ambient, electronic control unit (ECU), Euro 6 standard, thermal interface materials (TIMs), nanotechnology, carbon nanotubes (CNTs), carbon nanofibres (CNFs), chemical vapour deposition (CVD)

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S. and Amalu, E.H. (2011) Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-8. ISBN 978-1-4673-0694-2 (print)

wall-slip behavior, solder pastes, isotropic conductive adhesives

Durairaj, R., Man, Lam Wai, Ramesh, S., Wea, Lim Chia, Leng, Eu Poh, Ekere, N.N., Mallik, S. and Seman, A. (2009) Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives. In: Electronics Packaging Technology Conference, 2009. EPTC '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 422-426. ISBN 978-1-4244-5099-2 (print), 978-1-4244-5100-5 (e-ISBN) (doi:https://doi.org/10.1109/EPTC.2009.5416511)

wall-slip effects, solder pastes, electronics assembly applications

Mallik, S., Ekere, N.N., Durairaj, R., Marks, A.E. and Seman, A. (2009) Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications. Materials & Design, 30 (10). pp. 4502-4506. ISSN 0261-3069 (doi:https://doi.org/10.1016/j.matdes.2009.05.028)

This list was generated on Mon Sep 21 06:34:57 2020 UTC.