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A methodology for characterising new lead-free solder paste formulations used for flip-chip assembly applications

A methodology for characterising new lead-free solder paste formulations used for flip-chip assembly applications

Ekere, N and Mallik, Sabuj (2008) A methodology for characterising new lead-free solder paste formulations used for flip-chip assembly applications. In: Kobayashi, Akira, (ed.) Smart processing technology: SPT '07. High Temperature Society of Japan, Ibaraki, Japan, pp. 59-64.

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Abstract

The paper reports on the investigation of the rheological behaviour new lead-free solder pastes formulations for use in flip-chip assembly applications. The study is made up of three parts; namely the evaluation of the effect of plate geometry, the effect of temperature and processing environment and the effect of torsional frequencies on the rheological measurements. Different plate geometries and rheological tests were used to evaluate new formulations in terms of wall slip characteristics, linear viscoelastic region and shear thinning behaviour. A technique which combines the use of the creep-recovery and dynamic frequency sweep tests was used to further characterise the paste structure, rheological behaviour and the processing performance of the new paste formulations. The technique demonstrated in this study has wide utility for R & D personnel involved in new paste formulation, for implementing quality control procedures used in paste manufacture and packaging and for qualifying new flip-chip assembly lines

Item Type: Book Section
Additional Information: This paper was published in the proceedings of the Second International Symposium on Smart Processing Technology, held 27-28 Nov 2007, Osaka Japan.
Uncontrolled Keywords: lead-free soldering, new solder paste formulation, flip chip assembly, ultra-fine pitch assembly, wall-slip, creep-recovery, rheological characterisation,
Subjects: T Technology > T Technology (General)
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Pre-2014 Departments: School of Engineering
School of Engineering > Department of Engineering Systems
School of Engineering > Manufacturing Engineering Research Group
Related URLs:
Last Modified: 14 Oct 2016 09:07
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/2656

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