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Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

Durairaj, R., Ramesh, S., Mallik, S., Seman, A. and Ekere, N. (2009) Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes. Materials and Design, 30 (9). pp. 3812-3818. ISSN 0261-3069 (doi:

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Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G0) is higher than the liquid characteristic (G0 0) for the pastes material. In addition, the results from the study showed that the solder paste with a large G0 = G0 0 has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (d) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.

Item Type: Article
Uncontrolled Keywords: lead-free solder paste, rheology, stencil printing
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Faculty / Department / Research Group: Faculty of Engineering & Science
Related URLs:
Last Modified: 14 Oct 2016 09:04
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
Selected for REF2021: None

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