Items where Greenwich Author is "Best, Christopher How"
2015
Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan
ORCID: https://orcid.org/0000-0001-6091-1226
(2015)
Statistical analysis of the impact of refinishing process on leaded components.
Microelectronics Reliability, 55 (2).
pp. 424-431.
ISSN 0026-2714
(doi:10.1016/j.microrel.2014.11.001)
2013
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879, Alam, M.O., Yin, Chunyan
ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim
(2013)
Modelling methodology for thermal analysis of hot solder dip process.
Microelectronics Reliability, 53 (8).
pp. 1055-1067.
ISSN 0026-2714
(doi:10.1016/j.microrel.2013.02.018)
2012
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Yin, Chunyan
ORCID: https://orcid.org/0000-0003-0298-0420, Alam, M.O., Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Tollafield, Peter
(2012)
Experimental and modelling study on the effects of refinishing lead-free microelectronic components.
In: 2012 4th Electronic System-Integration Technology Conference (ESTC).
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.
ISBN 9781467346450
(doi:10.1109/ESTC.2012.6542213)