HTE, miniaturization, materials, packaging

Amalu, E.H., Ekere, N.N. and Bhatti, R.S. (2010) High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology. In: 2nd International Conference on Adaptive Science & Technology, 2009. (ICAST 2009). Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 146-153. ISBN 978-1-4244-3522-7 ISSN 0855-8906 (doi:https://doi.org/10.1109/ICASTECH.2009.5409731)

Product Life Cycle Management (PLM), Computer Aided Design and Manufacturing (CAD/CAM), Enterprise Resource Planning (ERP), Product structure and information model.

Giddaluru, Muni Prasad, Gao, J.X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2015) A modular product structure based methodology for seamless information flow in PLM system implementation. Computer-Aided Design and Applications, 12 (6). pp. 742-752. ISSN 1686-4360 (Print), 1686-4360 (Online) (doi:https://doi.org/10.1080/16864360.2015.1033339)

Product Lifecycle Management, Product Development, Modular Product Structure

Giddaluru, Muni Prasad, Gao, J.X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2015) Incorporating modular structure principles for global product development knowledge management in PLM system implementation. In: Proceedings of the 13th International Conference on Manufacturing Research (ICMR2015). Not known, pp. 123-128.

Product lifecycle management; Modular architecture; Product data and knowledge management

Giddaluru, Muni Prasad, Gao, James X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2017) Integrating product knowledge with modular product structures in PLM. In: ICIDM2017: International Conference on Innovative Design and Manufacturing, July 17-19, 2017, Milan, Italy.

SMEs, make to order, (MTO), management systems,

Pillai, Sreejit, Arokiam, Alan, Bhatti, Raj and Collins, T. (2011) Make to order manufacturing and operational management strategies – a case study at Priorclave Ltd. In: 18th International Annual EurOMA Conference: Exploring Interfaces, 3-6 Jul 2011, Cambridge, UK. (Unpublished)

STL, rapid prototyping

Sahatoo, Divesh, Chowdary, Boppana V., Ali, Fahraz F. and Bhatti, Rajinderpal (2008) Slicing issues in CAD translation to STL in rapid prototyping. Proceedings of The 2008 IAJC-IJME International Conference. International Association of Journals and Conferences/International Journal of Modern Engineering, California State University, Northridge. ISBN 9781606433799

binder, moulding sand, yam flour, foundry

Shehu, T. and Bhatti, R.S. (2012) The use of Yam flour (starch) as binder for sand mould production in Nigeria. World Applied Sciences Journal, 16 (6). pp. 858-862. ISSN 1818-495 (doi:wasj/wasj16(6)12/14.pdf)

chip scale package (CSP) technology, solder thermal interface materials (STIMs), out-gassing phenomenon, defective metallisation, finite element analysis (FEA)

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)

chip-scale packaged power device, automotive applications, solder thermal interface materials (STIMs), three-dimensional finite element analysis, lead-free solder

Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Mallik, S., Amalu, E.H. and Ekpu, M. (2011) Thermal effects of die-attach voids location and style on performance of chip level package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 231-236. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145176)

electronic control unit, thermal management, metal matrix composites, thermal conductive polymer, thermal interface material

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:https://doi.org/10.1016/j.applthermaleng.2010.09.023)

enterprise resource planning, ERP, make-to-order, SMEs, discrete event simulation, critical success factors

Pillai, Sreejit, Arokiam, Alan and Bhatti, Rajinderpal (2013) Linking simulation, critical success factors and enterprise resource planning in small and medium size enterprises. International Journal of Information Systems and Change Management, 6 (3). pp. 266-290. ISSN 1479-3121 (Print), 1479-313X (Online) (doi:https://doi.org/10.1504/IJISCM.2013.058337)

fatigue failure, finite element analysis, life prediction, thermal fatigue

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S. and Ekpu, M. (2012) Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach. Engineering Failure Analysis, 28. pp. 192-207. ISSN 1350-6307 (doi:https://doi.org/10.1016/j.engfailanal.2012.10.008)

firepolishing, micro-pipettes, in-vitro fertilization, borosilicate glass

Mayur, Yaul, Bhatti, Rajinderpal and Lawrence, Stephen (2008) Evaluating the process of borosilicate glass capillaries used for fabrication of in-vitro fertilization (IVF) micro-pipettes. Biomedical Microdevices, 10 (1). pp. 123-128. ISSN 1387-2176 (doi:https://doi.org/10.1007/s10544-007-9117-8)

high temperature electronics, solder joint reliability, surface mount components, thermal cycling, fatigue failure

Amalu, E.H., Ekere, N.N., Bhatti, R.S., Mallik, S., Takyi, G. and Ibhadode, A.O.A. (2011) Numerical investigation of thermo-mechanical behaviour of ball grid array solder joint at high temperature excursion. Advanced Materials Research, 367. pp. 287-292. ISSN 1662-8985 (Print), 1022-6680 (Online) (doi:https://doi.org/10.4028/www.scientific.net/AMR.367.287)

manufacturing business improvements, process improvements, cultural change, project success rate, strategy integration,

Bhatti, Rajinderpal and Berkhauer-Smith, Samantha (2007) Integrating both technical and cultural aspects of process improvement. In: 5th International Conference on Manufacturing Research (ICMR 2007), 11- 13 September 2007, De Montfort University Leicester. (Unpublished)

microelectronics, thermal efficiency, heat sink geometry, aluminium, copper

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145164)

process improvement, improving operations, integrated strategy application, improvement strategy methodology, manufacturing operations,

Bhatti, R. and Berkhauer-Smith, S. (2007) An integrated methodology of manufacturing business improvement strategies. In: Olhager, J. and Persson, F., (eds.) Advances in production management systems. International Federation for Information Processing, 246 . Springer, Boston, USA, pp. 355-362. ISBN 9780387741567 (doi:http://link.springer.com/chapter/10.1007/978-0-387-74157-4_42)

rapid prototyping, STL file generation, software errors, tolerance, file type,

Chowdary, Boppana V., Sahatoo, Divesh R. and Bhatti, Raj (2007) Some STL file generation issues in rapid prototyping. In: Esparragoza, Ivan E., Bermudez, Manuel and Petrie, Maria Larrondo, (eds.) 5th Latin American and Caribbean Conference for Engineering and Technology Developing Entrepreneural Engineers for the Sustainable Growth of Latin American and Caribbean: Education, Innovation, Technology, and Practice. Latin American and Caribbean Consortium of Engineering Institutions, Florida. ISBN 098228960X

reflow profile, lead-free soldering, solder joint integrity, flip chip, miniaturization

Amalu, Emeka H., Lui, Y.T., Ekere, Ndy, Bhatti, R.S. and Takyi, G. (2011) Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity. In: AIP Conference Proceedings. American Institute of Physics, Melville, NY, USA, pp. 639-644. (doi:https://doi.org/10.1063/1.3552519)

rheological behaviours, solder pastes, printing performance

Mallik, Sabuj, Thieme, Jens, Bauer, R., Ekere, Ndy, Seman, Anton, Bhatti, Rajinderpal and Durairaj, Rajkumar (2010) Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance. In: EPTC 2009 Proceedings of 2009 11th Electronics Packaging Technology Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 869-874. ISBN 978-1-4244-5099-2 (Print), 978-1-4244-5100-5 (e-ISBN) (doi:https://doi.org/10.1109/EPTC.2009.5416423)

solder die attach, voids and thermal resistance

Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Ekpu, M. and Adeyemi, J. (2011) Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device. In: Collection of Papers Presented at the 17th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC' 2011). EDA Publishing Association, Grenoble, France, pp. 115-119. ISBN 9782355000188

solder paste, flux, particle size measurement, creep, lead, rheology

Marks, Antony, Ekere, Ndy, Mallik, Sabuj and Bhatti, Rajinderpal (2011) Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead-free solder pastes. Soldering and Surface Mount Technology, 23 (2). pp. 75-84. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540911111120140)

solder pastes, lead-free, stretched exponential model, flux, rheology, time-dependent behaviors

Mallik, S., Ekere, N.N. and Bhatti, R. (2010) Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications. Journal of ASTM International, 7 (9). ISSN 1546-962X (doi:https://doi.org/10.1520/JAI103043)

solder voids, finite element analysis, solder die-attach, thermo-mechanical reliability, representative volume element

Otiaba, Kenny C., Okereke, M.I. ORCID: 0000-0002-2104-012X and Bhatti, R.S. (2014) Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material. Applied Thermal Engineering, 64 (1–2). 51 - 63. ISSN 1359-4311 (doi:https://doi.org/10.1016/j.applthermaleng.2013.12.006)

solders, thermal interface materials, fatigue, lead-free

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

stem cells, microtools

Yaul, M., Culme-Seymour, E., Ruban, L., Veratich, F. S. and Bhatti, R. (2008) Firepolished glass microtools for human embryonic stem cell (HESC) cultivation. In: 7th Annual UKSB Conference and Postgraduate Day, 26-28 June 2008, University of Liverpool, UK. (Unpublished)

stencil printing, Pb-free solder, reflow profile, solder deposit, transfer efficiency, surface mount packages

Amalu, E.H., Lau, W.K., Ekere, N.N., Bhatti, R.S., Mallik, S., Otiaba, K.C. and Takyi, G. (2011) A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Microelectronic Engineering, 88 (7). pp. 1610-1617. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2011.02.104)

thermal constriction, micro-contact, micro-gap, chip, heat sink

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2013.10.011)

thermal management materials, heat sink, thermal conductivity, coefficient of thermal expansion, density, cost, Al/SiC

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

thermal management, electronic control unit, materials, processing technology

Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2012) Thermal management materials for electronic control unit: trends, processing technology and R and D challenges. Advanced Materials Research, 367. pp. 301-307. ISSN 1022-6680 (Print), 1662-8985 (Online) (doi:https://doi.org/10.4028/www.scientific.net/AMR.367.301)

Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2010) Thermal management materials for electronic control unit: trends, processing technology and R&D challenges. In: International Conference on Engineering Research & Development: Advances in Engineering Science & Technology, 7-9 September 2010, Benin City, Africa.

thermal, interface, automotive, electronic unit

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)

under-hood automotive ambient, electronic control unit (ECU), Euro 6 standard, thermal interface materials (TIMs), nanotechnology, carbon nanotubes (CNTs), carbon nanofibres (CNFs), chemical vapour deposition (CVD)

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S. and Amalu, E.H. (2011) Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-8. ISBN 978-1-4673-0694-2 (print)