Cummins Power Generation

Giddaluru, Muni Prasad, Gao, J.X. ORCID: https://orcid.org/0000-0001-5625-3654 and Bhatti, Raj (2015) Incorporating modular structure principles for global product development knowledge management in PLM system implementation. In: Proceedings of the 13th International Conference on Manufacturing Research (ICMR2015). Not known, pp. 123-128.

Cummins Power Generation UK Ltd.

Giddaluru, Muni Prasad, Gao, J.X. ORCID: https://orcid.org/0000-0001-5625-3654 and Bhatti, Raj (2015) A modular product structure based methodology for seamless information flow in PLM system implementation. Computer-Aided Design and Applications, 12 (6). pp. 742-752. ISSN 1686-4360 (Print), 1686-4360 (Online) (doi:10.1080/16864360.2015.1033339)

EMERG

Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Ekpu, M. and Adeyemi, J. (2011) Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device. In: Collection of Papers Presented at the 17th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC' 2011). EDA Publishing Association, Grenoble, France, pp. 115-119. ISBN 9782355000188

Petroleum Technology Development Fund (PTDF), Nigeria

Amalu, E.H., Lau, W.K., Ekere, N.N., Bhatti, R.S., Mallik, S., Otiaba, K.C. and Takyi, G. (2011) A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Microelectronic Engineering, 88 (7). pp. 1610-1617. ISSN 0167-9317 (doi:10.1016/j.mee.2011.02.104)

Amalu, Emeka H., Lui, Y.T., Ekere, Ndy, Bhatti, R.S. and Takyi, G. (2011) Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity. In: AIP Conference Proceedings. American Institute of Physics, Melville, NY, USA, pp. 639-644. (doi:10.1063/1.3552519)

School of Graduate Studies and Research of the University of the West Indies, St. Augustine Campus, Trinidad, under grant CRP.3GT

Sahatoo, Divesh, Chowdary, Boppana V., Ali, Fahraz F. and Bhatti, Rajinderpal (2008) Slicing issues in CAD translation to STL in rapid prototyping. Proceedings of The 2008 IAJC-IJME International Conference. International Association of Journals and Conferences/International Journal of Modern Engineering, California State University, Northridge. ISBN 9781606433799

University of Greenwich Bursary

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:10.1109/ICASTech.2011.6145164)