Giddaluru, Muni Prasad, Gao, James X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2017) Integrating product knowledge with modular product structures in PLM. In: ICIDM2017: International Conference on Innovative Design and Manufacturing, July 17-19, 2017, Milan, Italy.

Giddaluru, Muni Prasad, Gao, J.X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2015) A modular product structure based methodology for seamless information flow in PLM system implementation. Computer-Aided Design and Applications, 12 (6). pp. 742-752. ISSN 1686-4360 (Print), 1686-4360 (Online) (doi:https://doi.org/10.1080/16864360.2015.1033339)

Giddaluru, Muni Prasad, Gao, J.X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2015) Incorporating modular structure principles for global product development knowledge management in PLM system implementation. In: Proceedings of the 13th International Conference on Manufacturing Research (ICMR2015). Not known, pp. 123-128.

Otiaba, Kenny C., Okereke, M.I. ORCID: 0000-0002-2104-012X and Bhatti, R.S. (2014) Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material. Applied Thermal Engineering, 64 (1–2). 51 - 63. ISSN 1359-4311 (doi:https://doi.org/10.1016/j.applthermaleng.2013.12.006)

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2013.10.011)

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

Pillai, Sreejit, Arokiam, Alan and Bhatti, Rajinderpal (2013) Linking simulation, critical success factors and enterprise resource planning in small and medium size enterprises. International Journal of Information Systems and Change Management, 6 (3). pp. 266-290. ISSN 1479-3121 (Print), 1479-313X (Online) (doi:https://doi.org/10.1504/IJISCM.2013.058337)

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S. and Ekpu, M. (2012) Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach. Engineering Failure Analysis, 28. pp. 192-207. ISSN 1350-6307 (doi:https://doi.org/10.1016/j.engfailanal.2012.10.008)

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)

Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2012) Thermal management materials for electronic control unit: trends, processing technology and R and D challenges. Advanced Materials Research, 367. pp. 301-307. ISSN 1022-6680 (Print), 1662-8985 (Online) (doi:https://doi.org/10.4028/www.scientific.net/AMR.367.301)

Shehu, T. and Bhatti, R.S. (2012) The use of Yam flour (starch) as binder for sand mould production in Nigeria. World Applied Sciences Journal, 16 (6). pp. 858-862. ISSN 1818-495 (doi:wasj/wasj16(6)12/14.pdf)

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)

Amalu, E.H., Ekere, N.N., Bhatti, R.S., Mallik, S., Takyi, G. and Ibhadode, A.O.A. (2011) Numerical investigation of thermo-mechanical behaviour of ball grid array solder joint at high temperature excursion. Advanced Materials Research, 367. pp. 287-292. ISSN 1662-8985 (Print), 1022-6680 (Online) (doi:https://doi.org/10.4028/www.scientific.net/AMR.367.287)

Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Ekpu, M. and Adeyemi, J. (2011) Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device. In: Collection of Papers Presented at the 17th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC' 2011). EDA Publishing Association, Grenoble, France, pp. 115-119. ISBN 9782355000188

Pillai, Sreejit, Arokiam, Alan, Bhatti, Raj and Collins, T. (2011) Make to order manufacturing and operational management strategies – a case study at Priorclave Ltd. In: 18th International Annual EurOMA Conference: Exploring Interfaces, 3-6 Jul 2011, Cambridge, UK. (Unpublished)

Amalu, E.H., Lau, W.K., Ekere, N.N., Bhatti, R.S., Mallik, S., Otiaba, K.C. and Takyi, G. (2011) A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Microelectronic Engineering, 88 (7). pp. 1610-1617. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2011.02.104)

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S. and Amalu, E.H. (2011) Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-8. ISBN 978-1-4673-0694-2 (print)

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:https://doi.org/10.1016/j.applthermaleng.2010.09.023)

Amalu, Emeka H., Lui, Y.T., Ekere, Ndy, Bhatti, R.S. and Takyi, G. (2011) Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity. In: AIP Conference Proceedings. American Institute of Physics, Melville, NY, USA, pp. 639-644. (doi:https://doi.org/10.1063/1.3552519)

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

Marks, Antony, Ekere, Ndy, Mallik, Sabuj and Bhatti, Rajinderpal (2011) Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead-free solder pastes. Soldering and Surface Mount Technology, 23 (2). pp. 75-84. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540911111120140)

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145164)

Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Mallik, S., Amalu, E.H. and Ekpu, M. (2011) Thermal effects of die-attach voids location and style on performance of chip level package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 231-236. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145176)

Mallik, S., Ekere, N.N. and Bhatti, R. (2010) Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications. Journal of ASTM International, 7 (9). ISSN 1546-962X (doi:https://doi.org/10.1520/JAI103043)

Mallik, Sabuj, Thieme, Jens, Bauer, R., Ekere, Ndy, Seman, Anton, Bhatti, Rajinderpal and Durairaj, Rajkumar (2010) Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance. In: EPTC 2009 Proceedings of 2009 11th Electronics Packaging Technology Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 869-874. ISBN 978-1-4244-5099-2 (Print), 978-1-4244-5100-5 (e-ISBN) (doi:https://doi.org/10.1109/EPTC.2009.5416423)

Amalu, E.H., Ekere, N.N. and Bhatti, R.S. (2010) High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology. In: 2nd International Conference on Adaptive Science & Technology, 2009. (ICAST 2009). Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 146-153. ISBN 978-1-4244-3522-7 ISSN 0855-8906 (doi:https://doi.org/10.1109/ICASTECH.2009.5409731)

Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2010) Thermal management materials for electronic control unit: trends, processing technology and R&D challenges. In: International Conference on Engineering Research & Development: Advances in Engineering Science & Technology, 7-9 September 2010, Benin City, Africa.

Yaul, M., Culme-Seymour, E., Ruban, L., Veratich, F. S. and Bhatti, R. (2008) Firepolished glass microtools for human embryonic stem cell (HESC) cultivation. In: 7th Annual UKSB Conference and Postgraduate Day, 26-28 June 2008, University of Liverpool, UK. (Unpublished)

Mayur, Yaul, Bhatti, Rajinderpal and Lawrence, Stephen (2008) Evaluating the process of borosilicate glass capillaries used for fabrication of in-vitro fertilization (IVF) micro-pipettes. Biomedical Microdevices, 10 (1). pp. 123-128. ISSN 1387-2176 (doi:https://doi.org/10.1007/s10544-007-9117-8)

Sahatoo, Divesh, Chowdary, Boppana V., Ali, Fahraz F. and Bhatti, Rajinderpal (2008) Slicing issues in CAD translation to STL in rapid prototyping. Proceedings of The 2008 IAJC-IJME International Conference. International Association of Journals and Conferences/International Journal of Modern Engineering, California State University, Northridge. ISBN 9781606433799

Bhatti, Rajinderpal and Berkhauer-Smith, Samantha (2007) Integrating both technical and cultural aspects of process improvement. In: 5th International Conference on Manufacturing Research (ICMR 2007), 11- 13 September 2007, De Montfort University Leicester. (Unpublished)

Chowdary, Boppana V., Sahatoo, Divesh R. and Bhatti, Raj (2007) Some STL file generation issues in rapid prototyping. In: Esparragoza, Ivan E., Bermudez, Manuel and Petrie, Maria Larrondo, (eds.) 5th Latin American and Caribbean Conference for Engineering and Technology Developing Entrepreneural Engineers for the Sustainable Growth of Latin American and Caribbean: Education, Innovation, Technology, and Practice. Latin American and Caribbean Consortium of Engineering Institutions, Florida. ISBN 098228960X

Bhatti, R. and Berkhauer-Smith, S. (2007) An integrated methodology of manufacturing business improvement strategies. In: Olhager, J. and Persson, F., (eds.) Advances in production management systems. International Federation for Information Processing, 246 . Springer, Boston, USA, pp. 355-362. ISBN 9780387741567 (doi:http://link.springer.com/chapter/10.1007/978-0-387-74157-4_42)