Skip navigation

Browse by Journal Title

Browse by Journal Title

Up a level
Export as [feed] RSS
Jump to: R | Z
Number of items: 2.

R

Rizvi, M.J., Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2008.09.105)

Z

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

This list was generated on Tue Mar 19 14:00:14 2024 UTC.