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R

Rizvi, M.J., Lu, Hua and Bailey, Christopher (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:10.1016/j.tsf.2008.09.105)

Z

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S. H., Bailey, C. and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

This list was generated on Wed Nov 14 13:18:33 2018 GMT.