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Number of items: 32.

Acoustic pressure

Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2015.10.009)

Activity model

Ciurana, J., Ferrer, I. and Gao, J. X. (2006) Activity model and computer aided system for defining sheet metal process planning. Journal of Materials Processing Technology, 173 (2). pp. 213-222. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2005.11.031)

Cavitation bubbles

Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2015.10.009)

Cavitometer

Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2015.10.009)

composite materials manufacturing

Li, Nanya, Li, Yingguang, Hang, Xiang and Gao, James (2014) Analysis and optimization of temperature distribution in carbon fiber reinforced composite materials during microwave curing process. Journal of Materials Processing Technology, 214 (3). pp. 544-550. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2013.10.012)

Computer aided process planning

Ciurana, J., Ferrer, I. and Gao, J. X. (2006) Activity model and computer aided system for defining sheet metal process planning. Journal of Materials Processing Technology, 173 (2). pp. 213-222. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2005.11.031)

Decision support system

Ciurana, J., Ferrer, I. and Gao, J. X. (2006) Activity model and computer aided system for defining sheet metal process planning. Journal of Materials Processing Technology, 173 (2). pp. 213-222. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2005.11.031)

Drawing processes

Ciurana, J., Ferrer, I. and Gao, J. X. (2006) Activity model and computer aided system for defining sheet metal process planning. Journal of Materials Processing Technology, 173 (2). pp. 213-222. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2005.11.031)

extrusion

Williams, A.J., Croft, T.N. and Cross, M. (2002) Computational modelling of metal extrusion and forging processes. Journal of Materials Processing Technology, 125-6. pp. 573-582. ISSN 0924-0136 (doi:10.1016/S0924-0136(02)00401-6)

fatigue failures

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

finite volume

Williams, A.J., Croft, T.N. and Cross, M. (2002) Computational modelling of metal extrusion and forging processes. Journal of Materials Processing Technology, 125-6. pp. 573-582. ISSN 0924-0136 (doi:10.1016/S0924-0136(02)00401-6)

flip chip

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

flip-chip

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2008.09.013)

forging

Williams, A.J., Croft, T.N. and Cross, M. (2002) Computational modelling of metal extrusion and forging processes. Journal of Materials Processing Technology, 125-6. pp. 573-582. ISSN 0924-0136 (doi:10.1016/S0924-0136(02)00401-6)

Frequency spectrum

Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2015.10.009)

high temperature electronics

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

intermetallic compound

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

isotropic conductive adhesives

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2008.09.013)

lead-free

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2008.09.013)

linear visco-elastic

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2008.09.013)

Liquid aluminium

Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2015.10.009)

microelectronics reliability

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

microwave curing

Li, Nanya, Li, Yingguang, Hang, Xiang and Gao, James (2014) Analysis and optimization of temperature distribution in carbon fiber reinforced composite materials during microwave curing process. Journal of Materials Processing Technology, 214 (3). pp. 544-550. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2013.10.012)

optimization

Li, Nanya, Li, Yingguang, Hang, Xiang and Gao, James (2014) Analysis and optimization of temperature distribution in carbon fiber reinforced composite materials during microwave curing process. Journal of Materials Processing Technology, 214 (3). pp. 544-550. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2013.10.012)

Pb-free solder

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

power electronics

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

rheology

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2008.09.013)

Sheet metal processes

Ciurana, J., Ferrer, I. and Gao, J. X. (2006) Activity model and computer aided system for defining sheet metal process planning. Journal of Materials Processing Technology, 173 (2). pp. 213-222. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2005.11.031)

solder joint

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

solder paste

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2008.09.013)

temperature distribution

Li, Nanya, Li, Yingguang, Hang, Xiang and Gao, James (2014) Analysis and optimization of temperature distribution in carbon fiber reinforced composite materials during microwave curing process. Journal of Materials Processing Technology, 214 (3). pp. 544-550. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2013.10.012)

Ultrasound

Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2015.10.009)

This list was generated on Tue May 22 12:48:11 2018 BST.