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Number of items: 6.

A

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

C

Ciurana, J., Ferrer, I. and Gao, J. X. (2006) Activity model and computer aided system for defining sheet metal process planning. Journal of Materials Processing Technology, 173 (2). pp. 213-222. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2005.11.031)

D

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2008.09.013)

L

Li, Nanya, Li, Yingguang, Hang, Xiang and Gao, James (2014) Analysis and optimization of temperature distribution in carbon fiber reinforced composite materials during microwave curing process. Journal of Materials Processing Technology, 214 (3). pp. 544-550. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2013.10.012)

T

Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2015.10.009)

W

Williams, A.J., Croft, T.N. and Cross, M. (2002) Computational modelling of metal extrusion and forging processes. Journal of Materials Processing Technology, 125-6. pp. 573-582. ISSN 0924-0136 (doi:10.1016/S0924-0136(02)00401-6)

This list was generated on Fri May 25 04:35:17 2018 BST.