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Number of items: 6.

A

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)

C

Ciurana, J., Ferrer, I. and Gao, J. X. (2006) Activity model and computer aided system for defining sheet metal process planning. Journal of Materials Processing Technology, 173 (2). pp. 213-222. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2005.11.031)

D

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2008.09.013)

L

Li, Nanya, Li, Yingguang, Hang, Xiang and Gao, James (2014) Analysis and optimization of temperature distribution in carbon fiber reinforced composite materials during microwave curing process. Journal of Materials Processing Technology, 214 (3). pp. 544-550. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2013.10.012)

T

Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. ORCID: 0000-0002-7426-9999 (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2015.10.009)

W

Williams, A.J., Croft, T.N. and Cross, M. (2002) Computational modelling of metal extrusion and forging processes. Journal of Materials Processing Technology, 125-6. pp. 573-582. ISSN 0924-0136 (doi:10.1016/S0924-0136(02)00401-6)

This list was generated on Sun Nov 18 02:58:49 2018 GMT.