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Items where Author is "Strusevich, N."

Items where Author is "Strusevich, N."

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Number of items: 57.

accelerated temperature cycle

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

acoustic streaming

Strusevich, N., Bailey, C. and Patel, M.K. (2013) Computational modeling of electrodepostion in small features under megasonic agitation. In: 2013 European Microelectronics Packaging Conference (EMPC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C., Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

aspect ratio

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C., Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

backlights

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

caking

Chapelle, P., Christakis, N., Wang, J., Strusevich, N., Patel, M.K., Cross, M., Abou-Chakra, H., Baxter, J. and Tuzun, U. (2005) Application of simulation technologies in the analysis of granular material behaviour during transport and storage. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 219 (1). pp. 43-52. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440805X7044)

CCFL

Lee, Yek Bing, Strusevich, N., Yan-Yin, Chun and Bailey, C. (2009) Analysis tools for thermal characterization, performance and reliability of rugged electronic displays. In: ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-5. ISBN 978-1-4244-4260-7 (doi:10.1109/ISSE.2009.5206926)

continuum modelling

Chapelle, P., Christakis, N., Wang, J., Strusevich, N., Patel, M.K., Cross, M., Abou-Chakra, H., Baxter, J. and Tuzun, U. (2005) Application of simulation technologies in the analysis of granular material behaviour during transport and storage. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 219 (1). pp. 43-52. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440805X7044)

degradation

Chapelle, P., Christakis, N., Wang, J., Strusevich, N., Patel, M.K., Cross, M., Abou-Chakra, H., Baxter, J. and Tuzun, U. (2005) Application of simulation technologies in the analysis of granular material behaviour during transport and storage. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 219 (1). pp. 43-52. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440805X7044)

electrodeposition

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C., Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

electrodeposition of copper

Costello, S., Strusevich, N., Flynn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2013) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies, 19 (6). pp. 783-790. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-013-1746-7)

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

electrolyte fluid flow

Costello, S., Strusevich, N., Patel, M.K., Bailey, C., Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

electroplating

Strusevich, N., Bailey, C. and Patel, M.K. (2013) Computational modeling of electrodepostion in small features under megasonic agitation. In: 2013 European Microelectronics Packaging Conference (EMPC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C., Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

embedded die

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

fatigue life-time

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

fibre optic hydrophone

Costello, S., Strusevich, N., Patel, M.K., Bailey, C., Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

finite element analysis

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

fluid flow

Costello, S., Strusevich, N., Flynn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2013) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies, 19 (6). pp. 783-790. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-013-1746-7)

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

granular materials

Chapelle, P., Christakis, N., Wang, J., Strusevich, N., Patel, M.K., Cross, M., Abou-Chakra, H., Baxter, J. and Tuzun, U. (2005) Application of simulation technologies in the analysis of granular material behaviour during transport and storage. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 219 (1). pp. 43-52. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440805X7044)

high aspect ratio microvia

Strusevich, N., Bailey, C. and Patel, M.K. (2013) Computational modeling of electrodepostion in small features under megasonic agitation. In: 2013 European Microelectronics Packaging Conference (EMPC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.

high aspect ratio microvias

Costello, S., Strusevich, N., Patel, M.K., Bailey, C., Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

LCD

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

lead free solder interconnects

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

LED

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

LEDs

Lee, Yek Bing, Strusevich, N., Yan-Yin, Chun and Bailey, C. (2009) Analysis tools for thermal characterization, performance and reliability of rugged electronic displays. In: ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-5. ISBN 978-1-4244-4260-7 (doi:10.1109/ISSE.2009.5206926)

light emitting diodes (LEDs)

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

Yek, Bing Lee, Strusevich, N., Bailey, C., Chun-Yan, Yin and Cartwright, C. (2009) Packaging of light emitting diodes for display backlights: Need for multi-disciplinary design tools. In: Electronic Packaging Technology & High Density Packaging, 2009. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 205-208. ISBN 978-1-4244-4659-9 (online), 978-1-4244-4658-2 (print) (doi:10.1109/ICEPT.2009.5270764)

luminance

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

mechanical

Lee, Yek Bing, Strusevich, N., Yan-Yin, Chun and Bailey, C. (2009) Analysis tools for thermal characterization, performance and reliability of rugged electronic displays. In: ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-5. ISBN 978-1-4244-4260-7 (doi:10.1109/ISSE.2009.5206926)

megasonic agitation

Costello, S., Strusevich, N., Flynn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2013) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies, 19 (6). pp. 783-790. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-013-1746-7)

Strusevich, N., Bailey, C. and Patel, M.K. (2013) Computational modeling of electrodepostion in small features under megasonic agitation. In: 2013 European Microelectronics Packaging Conference (EMPC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C., Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

micro-mechanical parametrizations

Chapelle, P., Christakis, N., Wang, J., Strusevich, N., Patel, M.K., Cross, M., Abou-Chakra, H., Baxter, J. and Tuzun, U. (2005) Application of simulation technologies in the analysis of granular material behaviour during transport and storage. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 219 (1). pp. 43-52. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440805X7044)

micro-particle imaging velocimetry (micro-PIV)

Costello, S., Strusevich, N., Flynn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2013) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies, 19 (6). pp. 783-790. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-013-1746-7)

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

Costello, S., Strusevich, N., Patel, M.K., Bailey, C., Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

numerical modeling

Strusevich, N., Bailey, C. and Patel, M.K. (2013) Computational modeling of electrodepostion in small features under megasonic agitation. In: 2013 European Microelectronics Packaging Conference (EMPC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.

numerical optimisation

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

optical and thermal modelling techniques

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

optical behaviour

Lee, Yek Bing, Strusevich, N., Yan-Yin, Chun and Bailey, C. (2009) Analysis tools for thermal characterization, performance and reliability of rugged electronic displays. In: ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-5. ISBN 978-1-4244-4260-7 (doi:10.1109/ISSE.2009.5206926)

printed circuit board (PCB)

Costello, S., Strusevich, N., Patel, M.K., Bailey, C., Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

ruggedized electronic display

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

Yek, Bing Lee, Strusevich, N., Bailey, C., Chun-Yan, Yin and Cartwright, C. (2009) Packaging of light emitting diodes for display backlights: Need for multi-disciplinary design tools. In: Electronic Packaging Technology & High Density Packaging, 2009. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 205-208. ISBN 978-1-4244-4659-9 (online), 978-1-4244-4658-2 (print) (doi:10.1109/ICEPT.2009.5270764)

segregation

Chapelle, P., Christakis, N., Wang, J., Strusevich, N., Patel, M.K., Cross, M., Abou-Chakra, H., Baxter, J. and Tuzun, U. (2005) Application of simulation technologies in the analysis of granular material behaviour during transport and storage. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 219 (1). pp. 43-52. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440805X7044)

side-by-side dies

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

SiP technology

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

stacked die

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

thermal

Lee, Yek Bing, Strusevich, N., Yan-Yin, Chun and Bailey, C. (2009) Analysis tools for thermal characterization, performance and reliability of rugged electronic displays. In: ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-5. ISBN 978-1-4244-4260-7 (doi:10.1109/ISSE.2009.5206926)

thermal management

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

thermo-mechanical reliability analysis

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

uncertainty analysis

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

warpage

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

This list was generated on Tue May 22 22:21:19 2018 BST.