Items where Author is "Strusevich, N."
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Article
Tsirkas, S.A., Papanikos, P., Pericleous, K., Strusevich, N., Boitout, F. and Bergheau, J.M. (2003) Evaluation of distortions in laser welded shipbuilding parts using local-global finite element approach. Science and Technology of Welding & Joining, 8 (2). pp. 79-88. ISSN 1362-1718 (print), 1743-2936 (online) (doi:10.1179/136217103225010899)
Conference Proceedings
Costello, S., Strusevich, N., Patel, M.K., Bailey, C., Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606
Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. International Symposium on Advanced Packaging Materials . IEEE Xplore Digital Library, Piscataway, NJ, USA, pp. 98-101. ISBN 978-1-4244-6756-3 (doi:10.1109/ISAPM.2010.5441377)
Yek, Bing Lee, Strusevich, N., Bailey, C., Chun-Yan, Yin and Cartwright, C. (2009) Packaging of light emitting diodes for display backlights: Need for multi-disciplinary design tools. In: Electronic Packaging Technology & High Density Packaging, 2009. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 205-208. ISBN 978-1-4244-4659-9 (online), 978-1-4244-4658-2 (print) (doi:10.1109/ICEPT.2009.5270764)
Lee, Yek Bing, Strusevich, N., Yan-Yin, Chun and Bailey, C. (2009) Analysis tools for thermal characterization, performance and reliability of rugged electronic displays. In: ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-5. ISBN 978-1-4244-4260-7 (doi:10.1109/ISSE.2009.5206926)