Skip navigation

Items where Author is "Bernasko, Peter"

Items where Author is "Bernasko, Peter"

Up a level
Export as [feed] RSS
Group by: Item Type | Uncontrolled Keywords | No Grouping
Number of items: 1.

Conference or Conference Paper

Bernasko, Peter, Mallik, Sabuj, Ekere, Ndy and Takyi, G. (2011) Evaluating the effect of pad sizes on the inter-metallic layer formation and growth for Sn-Ag-Cu solders on Cu metallization. In: International Conference on Electronics Packaging (ICEP) 2011, 13-15 April 2011, Nara Prefectural New Public Hall, Nara, Japan.

This list was generated on Tue Aug 21 21:51:13 2018 BST.