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Items where Author is "Bernasko, Peter"

Items where Author is "Bernasko, Peter"

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Bernasko, Peter, Mallik, Sabuj, Ekere, Ndy and Takyi, G. (2011) Evaluating the effect of pad sizes on the inter-metallic layer formation and growth for Sn-Ag-Cu solders on Cu metallization. In: International Conference on Electronics Packaging (ICEP) 2011, 13-15 April 2011, Nara Prefectural New Public Hall, Nara, Japan.

This list was generated on Tue Sep 18 16:32:21 2018 BST.