Items where Author is "Bailey, C."

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(CFD) (DFSI) 3D printing Abaqus® v. 6.9 accelerated temperature cycle acoustic streaming Additive Manufacturing adhesion adhesive adhesive bonding adhesive flows adhesives adhesives in electronics aerospace ageing (materials) Alienation analysis Analytical models anisotropic conductive film (ACF) anisotropic conductive films anisotropic magnetoresistance aspect ratio assembling assembly atomic diffusions atomic vacancies atomistic mechanics [e.g. axial and transverse coefficients of thermal expansion (CTE) backlight units backlights ball grid arrays Bayesian Networks (BN) blood flow bridge circuits butterfly module capillarity capillary carbon-nanotubes casting casting process CCFL cell-centred CFD CFD software chip scale packaging chip-on-board chip-on-board packaging circuit optimisation circuit reliability classical continuum mechanics (e.g. classical molecular dynamics (MD)] CNT-Cu TSVs Coffin-Manson commercial off-the shelf components composite compuational fluid dynamics (CFD) computational computational analysis software computational fluid dynamics computational mechanics computational modelling computational solid mechanics computer aided analysis computer control systems computer modelling computer simulation computing modelling conducting fluids conducting materials conducting polymers conductive adhesive conductive adhesives Conflicts in women’s callings conservation contact angle contact resistance continuum modelling conversion efficiency cooling copper coupled solution Cu columns Cu vias cure data cure kinetics cure kinetics models cure process curing curing of an encapsulant material curing process current loadings Cutty Sark damage data analysis data driven prognostics data-driven prognostics decision making autonomy delamination dense suspension design design environment design methodology Design of Experiment (DoE) method design of experiments design of experiments methods Designers deviance dielectric liquids differential scanning calorimetry (DSC) differential scanning calorimetry Differential Scanning Calorimetry (DSC) direct chill casting process domains dual-section microwave system dynamic fluid-structure interaction dynamic solid mechanics effect of reflow process effective thermal conductivity electric aircraft electric car electric field effects electro-migration electrodeposition electrodeposition of copper electrohydrodynamic electrolyte fluid flow electromagnetic heating Electromigration electronic components electronic cooling electronic design automation electronic engineering computing electronic packages electronic packaging electronic packaging thermal management electronic product assembly electronic production design electronic products electronics manufacturing electronics packaging electroplating electrostatic EM simulations embedded die encapsulant encapsulant curing encapsulant material encapsulants encapsulation energy management engineering computing environmental factors environmental management estimate of cure evaluation event history analysis failure failure analysis fatigue fatigue life-time fatigue of materials FEA ferrous operations fibre optic hydrophone filled polymers films (states of matter) fine-pitch technology finite difference time-domain analysis finite element Finite element analysis Finite Element Analysis (FEA) finite element analysis methods finite element method finite element modeling finite element modelling finite volume finite volume method finite volume methods finite volume unstructured mesh finite volumes finite-volume code five process parameters Flex-No-Lead project flexible circuit board flexible-substrates flip chip flip chip devices flip chip on flex flip chip packaging flip-chip flip-chip assembly flip-chip devices flip-chip devices printed circuit manufacture flip-chip packaging flipchip flow flow simulation fluid flow fluid structure interaction Fluids fluids engineering descriptors fluid–structure interaction flux focused ion beam Focused Ion Beam (FIB) method forced convection forging processes Fourier transform infra-red spectroscopy (FTIR) Garofalo equation gas flow Generative manufacturing geometric conservation law geometrically nonlinear geometry glass transition temperature granular flows Graphics processing units heat conduction heat transfer heating heatsink heterogeneous electronics based systems high aspect ratio microvia high aspect ratio microvias high performance High Performance Primitive Collections high-aspect ratio microfabrication higher-density interconnection historic hollow microstucture HPPC human vision models industrial plants instabilities insulated gate bipolar transistors integrated circuit integrated circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability Integrated Design of Experiments (DoE) integrated optoelectronics integrated software module integration interconnection technology interconnections interfaces (computer) interfaces (materials) intermetallic compounds isotropic conductive adhesive materials junction temperatures just-noticeable difference Kernel key design parameters key parameters laser laser beam welding Lateral IGBT LCD LCD displays lead free solder interconnects lead-free soldering lead-free solders LED LED backlighting devices LED displays LED driver LED drivers LEDs level set method life testing LIGBT light emitting diodes light emitting diodes (LEDs) load-induced thermal cycling loss modulus luminance machine learning magnetic fields manufacturing technicians Marangoni flow material deformation Materials materials processing materials properties materials science Materials scientist mathematics matrix Maxwell equations mechanical Mechanical engineering mechanical loading mechanics megasonic agitation metal migration metals casting metals extrusion metals processing methodology micro and nano system micro-machining process micro-particle imaging velocimetry (micro-PIV) microassembling microelectronic processing Microelectronics microelectronics manufacturing microelectronics packaging microfabrication Microfluidics microwave microwave cure microwave curing microwave curing system microwave devices microwave energy microwave heating microwave measurements microwave oven microwave ovens microwave processing microwave theory and techniques Miner's law of linear damage accumulation miniaturisation miniaturized consumer electronic products model implementation modeling modeling iron modelling modelling polymerisation modelling techniques modules moisture absorption Monte Carlo simulation multi-disciplinary analysis multi-disciplinary design multi-physics Multi-physics modeling multi-physics modelling multi-physics processes multi-scale computational simulations multiphase flow multiphysics analysis multiphysics modeling multiphysics modelling nanopatterning natural convection new two-layer hybrid kE/ki model Newmark algorithm nitrogen no-flow underfill materials non-Newtonian Numerical Analysis numerical modeling numerical modelling Numerical models Numerical Optimilation numerical optimisation numerical optimization material properties numerical simulation Oldroyd-B open-ended microwave oven open-ended waveguide cavity oven optical and thermal modelling techniques optical backplanes optical backplanes optical planar waveguides optical behaviour optical couplers optical performance optical simulation optical waveguides photodiodes optimal design optimisation optimisations optimization optoelectronic packages organic light emitting diodes ovens oxygen packaging parallel computer systems particle swarm optimisation algorithm particle swarm optimisation method particle swarm optimization performance data PHM PHYSICA physics of failure (PoF) Physics-of-failure (PoF) model pigtail fibre optic plastic deformation polymer crosslinking polymer cure kinetics models polymer cure models polymer films polymer solutions polymeric channels post weld stresses power bipolar transistors Power electronic module Power Electronic Module (PEM) power electronics power electronics modules (PEMs) power integrated circuits power modules power system management power system modeling predictive reliability printed circuit board (PCB) printed circuit boards printing probabilities Product developers product functionality Production technicians Production technology prognostic and health management (PHM)systems prognostics framework prognostics health management quadratic response qualification testing quality quantum mechanics (e.g. radio frequency (RF) curing ray tracing calculations real-time health management real-time thermal models recirculation vortex recirculation vortices Reduced Order Models (ROM) refinishing reflow reflow soldering reinforcement method reinforcement technique reliability reliability prediction reliability targets reliable electronic packaging Religious work renewable energy resonant cavity resonant microwave applicator Response Surface response surface methodology Reynolds number rheology risk assessment ruggedized electronic display SAC alloy scanning acoustic microscopes second level semiconductor device semiconductor device modeling semiconductor device packaging semiconductor device reliability semiconductor lasers semiconductor process modelling Sensitivity analysis ship side-by-side dies silicon simulation technique simulation tools SiP technology Sn-2.8Ag-0.5Cu-1.0Bi SnPb and SnAgCu (solder alloys) social support software solder balls solder degradation solder joint solder joints Solder material solder paste solder pastes soldered joints soldering solders solders thermal stress cracking solid mechanics solid state lighting solid state lighting systems solidification stacked die steelmaking processes stencil printing stencils storage modulus stoves strength of materials stress structure surface surface emitting lasers surface mount packages surface mount technology Surface tension Surrogate models SWCNT (single walled carbon nanotube)-Cu composites task identity task performance task variety technology management temperature temperature distribution temperature measurement tension the density functional method) the finite element method) thermal thermal analysis thermal cycling thermal expansion thermal management thermal management (packaging) thermal management of electronics thermal stresses thermo-mechanical loading thermo-mechanical reliability analysis thermomechanical stress development Thermomigration thermosetting polymer thick film chip resistors Thin film through-hole packages time to failure Topological Optimisation transient structural dynamics transitional flow turbulence turbulence modelling turbulence models uncertainty analysis underfill underfilling unstructured variable frequency microwave (VFM) heating Variable Frequency Microwave (VFM) system vertex-based vibration vibration test viewability virtual manufacturing virtual prototyping environment viscoelastic Vocation void formation voids evolution warpage wave soldering waveguide resonator wear-out mechanisms Wettability wetting force wire-bond lifting Women priests Women’s callings Work intensity of callings X ray microscopes zonal model

Number of items: 767.

(CFD)

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2003) Turbulence modelling and its effects on electronic systems. In: Turbulence, Heat and Mass Transfer 4. Begell House, New York, USA. Oxfordshire, UK, pp. 625-632. ISBN 1567001963

(DFSI)

Slone, A.K., Pericleous, K. ORCID: 0000-0002-7426-9999 , Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2001) Details of an integrated approach to three-dimensional dynamic fluid structure interaction. In: Fluid Structure Interaction. WIT Press, Southampton, UK, pp. 57-66. ISBN 1853128813 ISSN 1353-808x

3D printing

Bailey, C. ORCID: 0000-0002-9438-3879 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

Abaqus® v. 6.9

Sinha, A., Mihailovic, J.A., Morris, J.E., Hua, Lu and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application. In: Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE. Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE . IEEE Xplore Digital Library, Monterey, CA, pp. 262-266. ISBN 978-1-4244-8896-4 (doi:https://doi.org/10.1109/NMDC.2010.5652157)

accelerated temperature cycle

Bailey, C. ORCID: 0000-0002-9438-3879 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283556)

acoustic streaming

Strusevich, N., Bailey, C. ORCID: 0000-0002-9438-3879 and Patel, M.K. (2013) Computational modeling of electrodepostion in small features under megasonic agitation. In: 2013 European Microelectronics Packaging Conference (EMPC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

Additive Manufacturing

Tilford, T. ORCID: 0000-0001-8307-6403 , Bruan, J., Janhsen, J. C., Burgard, M. and Bailey, C. ORCID: 0000-0002-9438-3879 (2018) SPH analysis of inkjet droplet impact dynamics. In: Proceedings of the 13th World Congress on Computational Mechanics (WCCM XIII) and 2nd Pan American Congress on Computational Mechanics (PANACM II). WCCM.

adhesion

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 and Sharif, A. (2005) The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing. Soldering & Surface Mount Technology, 17 (2). pp. 40-48. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910510597492)

adhesive

Rizvi, M.J., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2007.05.045)

adhesive bonding

Yin, C.Y. ORCID: 0000-0003-0298-0420 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:https://doi.org/10.1109/AGEC.2004.1290912)

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:https://doi.org/10.1109/EPTC.2004.1396633)

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Kay, R., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271627)

adhesive flows

Glinski, G.P., Bailey, C. ORCID: 0000-0002-9438-3879 , Durairaj, R. and Ekere, N.N. (2002) Rheological characterization and multi-scale computational simulations of electrically conductive adhesive flows. In: IMAPS - Europe Cracow 2002, 16-18 June 2002, Cracow, Poland.

adhesives

Glinski, G.P. and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012543)

adhesives in electronics

Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 (eds.) (2011) Advanced adhesives in electronics, materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

aerospace

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Mackay, W., Bailey, C. ORCID: 0000-0002-9438-3879 , Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:https://doi.org/10.1109/EPTC.2004.1396627)

ageing (materials)

Alienation

Shantz, Amanda, Alfes, K., Bailey, C. and Soane, E. (2015) Drivers and Outcomes of Work Alienation: Reviving a Concept. Journal of Management Inquiry, 24 (4). pp. 382-393. ISSN 1056-4926 (Print), 1552-6542 (Online) (doi:https://doi.org/10.1177/1056492615573325)

analysis

Analytical models

Tilford, T. ORCID: 0000-0001-8307-6403 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tourloukis, G. and Bailey, C. ORCID: 0000-0002-9438-3879 (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-7. ISBN 978-1-5090-2106-2 (doi:https://doi.org/10.1109/EuroSimE.2016.7463358)

anisotropic conductive film (ACF)

Yin, C.Y. ORCID: 0000-0003-0298-0420 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2013) Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications. Microelectronic Engineering, 107. pp. 17-22. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2013.02.070)

Yin, C.Y. ORCID: 0000-0003-0298-0420 , Alam, M.O., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00348-7)

anisotropic conductive films

Yin, C.Y. ORCID: 0000-0003-0298-0420 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:https://doi.org/10.1109/ECTC.2003.1216359)

anisotropic magnetoresistance

aspect ratio

assembling

Lu, H. ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:https://doi.org/10.1109/EPTC.2002.1185694)

assembly

atomic diffusions

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: 0000-0002-4392-6562 , Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:https://doi.org/10.1109/ICEPT.2011.6066874)

atomic vacancies

atomistic mechanics [e.g.

Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2009) Nanopackaging simulation: properties and behavior of packaging materials. Nanotechnology Magazine, 3 (2). pp. 34-37. ISSN 1932-4510 (doi:https://doi.org/10.1109/MNANO.2009.932413)

axial and transverse coefficients of thermal expansion (CTE)

backlight units

Bailey, C. ORCID: 0000-0002-9438-3879 , Yin, C. ORCID: 0000-0003-0298-0420 , Lu, H. ORCID: 0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:https://doi.org/10.1109/ESIME.2011.5765859)

backlights

Bailey, C. ORCID: 0000-0002-9438-3879 , Lee, Y., Lu, H. ORCID: 0000-0002-4392-6562 , Strusevich, N. and Yin, C. ORCID: 0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:https://doi.org/10.1109/ISAPM.2010.5441377)

ball grid arrays

Bailey, C. ORCID: 0000-0002-9438-3879 , Stoyanov, S. ORCID: 0000-0001-6091-1226 and Lu, H. ORCID: 0000-0002-4392-6562 (2004) Reliability predictions for high density packaging. In: Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., U.S.A., pp. 121-128. ISBN 0780386205 (doi:https://doi.org/10.1109/HPD.2004.1346684)

Bayesian Networks (BN)

Yin, C.Y. ORCID: 0000-0003-0298-0420 , Lu, H. ORCID: 0000-0002-4392-6562 , Musallam, M., Bailey, C. ORCID: 0000-0002-9438-3879 and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684552)

blood flow

Grossman, D., Bailey, C. ORCID: 0000-0002-9438-3879 , Pericleous, K. ORCID: 0000-0002-7426-9999 and Slone, A. (2002) Computational modelling of blood flow and artery wall interaction. In: FEM Workshop 2002 [Proceedings]. University of Ulm, Germany, Ulm, Germany, pp. 88-94. ISBN 39806183558

bridge circuits

Yin, C.Y, ORCID: 0000-0003-0298-0420 , Lu, H. ORCID: 0000-0002-4392-6562 , Musallam, M., Bailey, C. ORCID: 0000-0002-9438-3879 and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763591)

butterfly module

Mallik, A., Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 and Firth, P. (2009) Design for reliability methodology for micro laser welding of pigtail fibres. In: Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4244-4161-7 (electronic), 978-1-4244-4160-0 (print) (doi:https://doi.org/10.1109/ESIME.2009.4938409)

capillarity

Tonry, C.E.H., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmuliez, M.P.Y. and Yu, W. (2013) Micro-scale modelling challenges in electric field assisted capillarity. In: Proceedings. 12th International Symposium on Distributed Computing and Applications to Business, Engineering & Science. DCABES 2013. IEEE Computer Society. Conference Publishing Services (CPS), Los Alamitos, CA, USA, 40- 43. ISBN 978-0769550602 (doi:https://doi.org/10.1109/DCABES.2013.57)

capillary

Chen, H., Yu, W., Cargill, S., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Tonry, C. and Desmulliez, M.P.Y. (2012) Self-encapsulated hollow microstructures formed by electric field-assisted capillarity. Microfluidics and Nanofluidics, 13 (1). pp. 75-82. ISSN 1613-4982 (Print), 1613-4990 (Online) (doi:https://doi.org/10.1007/s10404-012-0942-6)

carbon-nanotubes

Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, H. ORCID: 0000-0002-4392-6562 (2011) Interconnect technologies using carbon nanotubes: Current status and future challenges. In: 2011 34th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4577-2111-3 ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2011.6053539)

casting

Bailey, C. ORCID: 0000-0002-9438-3879 , Bounds, S., Cross, M., Moran, G, Pericleous, K. ORCID: 0000-0002-7426-9999 and Taylor, G. (1999) Multiphysics modeling and its application to the casting process. CMSE: Computer Modelling & Simulation in Engineering, 4 (3). pp. 206-212. ISSN 1083-3455

casting process

Cross, M., Williams, A., Bailey, C., Taylor, G.A., Pericleous, K. ORCID: 0000-0002-7426-9999 and Croft, T.N. (2000) Towards a comprehensive model of the direct chill casting process. In: Modeling of Casting, Welding and Advanced Solidification Processes IX [Proceedings]. Shaker, Aachen, Germany, pp. 713-720. ISBN 3826572300

Chow, P., Bailey, C. ORCID: 0000-0002-9438-3879 , Cross, M. and Pericleous, K.A. ORCID: 0000-0002-7426-9999 (1996) The numerical modelling of multi-physics phenomena: The shape casting process. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 101-104. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:https://doi.org/10.1002/zamm.19960761408)

CCFL

Lee, Yek Bing, Strusevich, N., Yan-Yin, Chun and Bailey, C. ORCID: 0000-0002-9438-3879 (2009) Analysis tools for thermal characterization, performance and reliability of rugged electronic displays. In: ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-5. ISBN 978-1-4244-4260-7 (doi:https://doi.org/10.1109/ISSE.2009.5206926)

cell-centred

Edussuriya, S.S., Williams, A.J. and Bailey, C. ORCID: 0000-0002-9438-3879 (2004) A cell-centred finite volume method for modelling viscoelastic flow. Journal of Non-Newtonian Fluid Mechanics, 117 (1). pp. 47-61. ISSN 0377-0257 (doi:https://doi.org/10.1016/j.jnnfm.2003.12.001)

CFD

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 , Saxena, N. and Adams, S. (2005) Optimising the wave soldering process for lead free solders. In: Proceeding of 2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability - (2005 AGEC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 125-128. ISBN 0780388062 (doi:https://doi.org/10.1109/AGEC.2005.1452331)

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. In: 2004 Proceedings, Twentieth IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM). Institute of Electrical and Electronics Engineers, Inc,, Piscataway, NJ, USA, pp. 278-285. ISBN 078038363X ISSN 1065-2221 (doi:https://doi.org/10.1109/STHERM.2004.1291335)

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304081)

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Turbulence modelling for thermal management of electronic systems. In: 12th Association of Computational Mechanics in Engineering Annual Conference (ACME 2004), 5-6 April 2004, Cardiff, Wales, UK. (Unpublished)

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271573)

Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Djambazov, G. ORCID: 0000-0001-8812-1269 , Shrimpton, J. and Jalili, V. (2003) Application of CFD in vacuum dezincing process. In: The 3rd International Conference on CFD in the Minerals and Process Industries [Proceedings]. CSIRO Publishing, Collingwood, Victoria, Australia, pp. 313-318. ISBN 978064309038X

Edussuriya, S.S., Williams, A.J. and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) A CFD study of the underfill encapsulation process in flip-chip packaging using the Oldroyd-B model. In: Proceedings of the 6th European Conference of Rheology, (eurheo 2002). LSP, Institute of Polymer Materials, Erlangen-Nuremberg, Germany, pp. 285-286.

Glinski, G.P., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K.A. ORCID: 0000-0002-7426-9999 (2001) A non-Newtonian computational fluid dynamics study of the stencil printing process. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 215 (4). pp. 437-446. ISSN 0954-4062 (Print), 2041-2983 (Online) (doi:https://doi.org/10.1243/0954406011520869)

Fallah, N.A., Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2000) CFD approach for solid mechanics analysis. In: European Congress on Computational Methods in Applied Sciences and Engineering. ECCOMAS 2000. [Proceedings]. ECCOMAS.

CFD software

Cross, M., Lyster, C, Bailey, C. ORCID: 0000-0002-9438-3879 , Croft, N., Ewer, J. ORCID: 0000-0003-0609-272X , Leggett, P., McManus, K., Pericleous, K.A. ORCID: 0000-0002-7426-9999 and Patel, M.K. (1996) PHYSICA - A software environment for the modelling of multi-physics phenomena. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 105-108. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:https://doi.org/10.1002/zamm.19960761408)

chip scale packaging

chip-on-board

Aliyu, A. M., Mouawad, B., Castellazzi, A., Rajaguru, P. ORCID: 0000-0002-6041-0517 , Bailey, C. ORCID: 0000-0002-9438-3879 , Pathirana, V., Uduampola, N., Trajkovic, T. and Ubrea, F. (2017) Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers. In: Proceedings of the 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD). IEEE, pp. 431-434. ISBN 978-4-88686-094-1 ISSN 1946-0201 (Online) (doi:https://doi.org/10.23919/ISPSD.2017.7988976)

chip-on-board packaging

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: 0000-0002-9438-3879 , Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318311)

circuit optimisation

Gwyer, D., Misselbrook, P., Bailey, C. ORCID: 0000-0002-9438-3879 , Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304070)

circuit reliability

classical continuum mechanics (e.g.

classical molecular dynamics (MD)]

CNT-Cu TSVs

Coffin-Manson

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:https://doi.org/10.1109/ITHERM.2000.866172)

commercial off-the shelf components

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.030)

composite

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Mason, P. and Bailey, C. ORCID: 0000-0002-9438-3879 (2006) Computational methodology for analysis of historic composite structures. In: Proceedings of the 5th International Conference on Engineering Computational Technology. Civil-Comp Press, Stirlingshire, UK. ISBN 1905088116 ISSN 1759-3433 (doi:https://doi.org/10.4203/ccp.84.132)

compuational fluid dynamics (CFD)

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 , Saxena, N. and Adams, S. (2004) Modelling the wave soldering process. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 553-558. ISBN 983251486X

computational

computational analysis software

Bailey, C. ORCID: 0000-0002-9438-3879 , Patel, M. and Kumar, S. (2001) Computational modelling-a key component in materials processing. Transactions of the Institution of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy, 110 (1). pp. 25-32. ISSN 0371-9553 (Print), 1743-2855 (Online) (doi:https://doi.org/10.1179/mpm.2001.110.1.25)

computational fluid dynamics

Cross, M., Croft, T. N., McBride, D., Slone, A. K., Williams, A. J., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2006) Computational fluid dynamics: advancements in technology for modeling iron and steelmaking processes. AIST Transactions - Iron and Steel Technology, 3 (7). pp. 155-163. ISSN 1547-0423

Bailey, C. ORCID: 0000-0002-9438-3879 , Taylor, G.A., Cross, M. and Chow, P. (1999) Discretisation procedures for multi-physics phenomena. Journal of Computational and Applied Mathematics, 103 (1). pp. 3-17. ISSN 0377-0427 (doi:https://doi.org/10.1016/S0377-0427(98)00236-2)

computational mechanics

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 and Cross, M. (2002) Integrated computational mechanics and optimization for design of electronic components. In: Parmee, Ian C. and Hajela, Prabhat, (eds.) Optimization In Industry. Springer Verlag, pp. 57-71. ISBN 9781852338342

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2001) Integrating computational mechanics and numerical optimization for the design of material properties in electronic packages. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 551-562. ISBN 0873395131

computational modelling

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 , Tang, Y.K., Marson, S., Dyer, A., Allen, D. and Desmulliez, M. (2010) Computational modelling and optimisation of the fabrication of nano-structures using focused ion beam and imprint forming technologies. Journal of Physics: Conference Series (JPCS), 253 (1):012008. ISSN 1742-6588 (Print), 1742-6596 (Online) (doi:https://doi.org/10.1088/1742-6596/252/1/012008)

Williams, A.J., Croft, T.N. and Cross, M. (2001) Computational modelling of metals extrusion and forging processes. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 481-490. ISBN 0873395131

Cross, M., McManus, K., Johnson, S.P., Ierotheou, C.S., Walshaw, C. ORCID: 0000-0003-0253-7779 , Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K.A. ORCID: 0000-0002-7426-9999 (1999) Computational modelling of multi-physics processes on high performance parallel computer systems. In: Allan, R.J., Guest, M.F., Simpson, A.D., Henty, D.S. and Nicole, D.A., (eds.) High-Performance Computing. Springer US, pp. 91-102. ISBN 978-0-306-46034-0 (doi:https://doi.org/10.1007/978-1-4615-4873-7_10)

computational solid mechanics

Taylor, G.A., Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2002) A vertex-based finite volume method applied to non-linear material problems in computational solid mechanics. International Journal for Numerical Methods in Engineering, 56 (4). pp. 507-529. ISSN 0029-5981 (Print), 1097-0207 (Online) (doi:https://doi.org/10.1002/nme.574)

computer aided analysis

computer control systems

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

computer modelling

Rosunally, Y.Z., Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 , Mason, P., Campbell, S., Monger, G. and Bell, I. (2011) Fusion approach for prognostics framework of heritage structure. IEEE Transactions on Reliability, 60 (1):570453. pp. 3-13. ISSN 0018-9529 (doi:https://doi.org/10.1109/TR.2011.2104451)

Rizvi, M.J., Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, H. ORCID: 0000-0002-4392-6562 (2010) Damage predictions in a chip resistor solder joint on flexible circuit board. Microelectronic Engineering, 87 (10). pp. 1889-1895. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2009.11.023)

Gwyer, D., Bailey, C. ORCID: 0000-0002-9438-3879 , Pericleous, K. ORCID: 0000-0002-7426-9999 , Philpott, D. and Misselbrook, P. (2003) Modelling the assembly and performance of optoelectronic packages. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 77-85. ISBN 0780370546

Lu, H. ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

computer simulation

Lu, H. ORCID: 0000-0002-4392-6562 , Hung, K.C., Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00092-6)

Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.1286122)

computing modelling

Pericleous, K.A. ORCID: 0000-0002-7426-9999 (2001) Computing the dynamic interaction of magnetic fields and turbulent conducting fluids in metals processing. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 5-22. ISBN 0873395131

conducting fluids

conducting materials

conducting polymers

conductive adhesive

conductive adhesives

Conflicts in women’s callings

Madden, Adrian ORCID: 0000-0002-3193-5808 , Bailey, C. and Kerr, R. C. J. (2015) 'For this I was made': Conflict and calling in the role of a woman priest. Work, Employment & Society, 29 (5). pp. 866-874. ISSN 0950-0170 (Print), 1469-8722 (Online) (doi:https://doi.org/10.1177/0950017014559962)

conservation

contact angle

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

contact resistance

continuum modelling

Christakis, N., Patel, M.K., Cross, M., Baxter, J., Abou-Chakra, H. and Tüzün, U. (2001) Continuum modelling of granular flows using PHYSICA, a 3-D unstructured, finite-volume code. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 129-138. ISBN 0873395131

conversion efficiency

cooling

copper

coupled solution

Tilford, T., Parrott, A.K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K.A. ORCID: 0000-0002-7426-9999 (2008) Multiphysics simulation of microwave processing using a multidomain coupled solver approach. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008). International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

Cu columns

Cu vias

cure data

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642820)

cure kinetics

Tilford, T., Ferenets, M., Morris, J., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Evaluation of polymer cure models in microelectronics packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)

cure kinetics models

Tilford, T. ORCID: 0000-0001-8307-6403 , Ferenets, M., Adamietz, R., Pavuluri, S. K., Desmulliez, M. P. Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 262-267. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:https://doi.org/10.1109/EPTC.2011.6184428)

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:https://doi.org/10.1109/ISSE.2010.5547360)

cure process

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276666)

curing

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:https://doi.org/10.1109/EPTC.2011.6184486)

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: 0000-0001-8307-6403 , Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Experimental investigation of open-ended microwave oven assisted encapsulation process. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-8553-6 (print), 978-1-4244-8554-3 (online) (doi:https://doi.org/10.1109/ESTC.2010.5643015)

Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879 , Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:https://doi.org/10.1109/DTIP.2008.4752943)

Wheeler, D. and Bailey, C. ORCID: 0000-0002-9438-3879 (2000) Modelling technology to predict flip-chip assembly. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 79-85. ISBN 0780359127 ISSN 0189-9870 (doi:https://doi.org/10.1109/ITHERM.2000.866174)

curing of an encapsulant material

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

curing process

Tilford, T. ORCID: 0000-0001-8307-6403 , Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642822)

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:https://doi.org/10.1260/1748-3018.4.1.121)

current loadings

Cutty Sark

damage

data analysis

Ahsan, M., Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 and Albarbar, A. (2020) Developing computational intelligence for smart qualification testing of electronic products. IEEE Access, 8. pp. 16922-16933. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2020.2967858)

data driven prognostics

Sutharssan, T., Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 and Rosunally, Y. (2012) Data analysis techniques for real-time prognostics and health management of semiconductor devices. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4673-0694-2 (print)

data-driven prognostics

decision making autonomy

delamination

dense suspension

design

design environment

design methodology

Tang, Ying Kit, Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:https://doi.org/10.1109/ESTC.2008.4684478)

Design of Experiment (DoE) method

design of experiments

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: 0000-0002-9438-3879 , Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271597)

design of experiments methods

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Optimisation of heatsink design for a ruggedised LCD display. In: 2011 International Conference on Electronic Packaging Technology & High Density Packaging. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 492-496. ISBN 9781457717703 (doi:https://doi.org/10.1109/ICEPT.2011.6066883)

Designers

deviance

dielectric liquids

differential scanning calorimetry (DSC)

Morris, J.E., Tilford, T. ORCID: 0000-0001-8307-6403 , Bailey, C. ORCID: 0000-0002-9438-3879 , Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:https://doi.org/10.1109/ISSE.2009.5206929)

differential scanning calorimetry

Differential Scanning Calorimetry (DSC)

direct chill casting process

domains

dual-section microwave system

dynamic fluid-structure interaction

dynamic solid mechanics

Slone, A.K., Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2002) Dynamic solid mechanics using finite volume methods. Applied Mathematical Modelling, 27 (2). pp. 69-87. ISSN 0307-904X (doi:https://doi.org/10.1016/S0307-904X(02)00060-4)

effect of reflow process

effective thermal conductivity

electric aircraft

Newcombe, D. R. and Bailey, C. ORCID: 0000-0002-9438-3879 (2007) Rapid solutions for application specific IGBT module design. International Exhibition and Conference for Power Electronics, Intelligent Motion and Power Quality (PCIM Europe 2007). Curran Associates, Inc., Red Hook , New York. ISBN 9781604231816

electric car

electric field effects

electro-migration

Bailey, C. ORCID: 0000-0002-9438-3879 , Zhu, X., Lu, H. ORCID: 0000-0002-4392-6562 and Yin, C. ORCID: 0000-0003-0298-0420 (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:https://doi.org/10.1109/EPTC.2012.6507130)

electrodeposition

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

electrodeposition of copper

Costello, S., Strusevich, N., Flynn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2013) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies, 19 (6). pp. 783-790. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-013-1746-7)

electrohydrodynamic

electrolyte fluid flow

Costello, S., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

electromagnetic heating

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: 0000-0001-8307-6403 , Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:https://doi.org/10.1109/TCPMT.2011.2177524)

Electromigration

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S.H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:https://doi.org/10.1109/ICEPT.2013.6756527)

electronic components

electronic cooling

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2005) Turbulence modelling for electronic cooling: A review. In: International Symposium on Electronics Materials and Packaging, EMPAS 2005. Institute of Electrical and Electronics Engineers Inc, Piscataway, USA, pp. 275-281. ISBN 1-4244-0107-0

electronic design automation

electronic engineering computing

electronic packages

electronic packaging

Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Introduction to adhesives joining technology for electronics. In: Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 , (eds.) Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Response Surface Modeling and Optimisation for Reliable Electronic Products. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 49-57. ISBN 0780398238

electronic packaging thermal management

Bailey, C. ORCID: 0000-0002-9438-3879 (2008) Thermal management technologies for electronic packaging: current capabilities and future challenges for modelling tools. In: 2008 10th Electronics Packaging Technology Conference (EPTC 2008) [Conference Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 527-532. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763487)

electronic product assembly

Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:https://doi.org/10.1016/S0168-9274(01)00065-4)

electronic production design

Bailey, C. ORCID: 0000-0002-9438-3879 (2003) Exploiting virtual prototyping for reliability assessment. In: Proceedings of International IEEE Conference on the Business of Product Reliability and Liability. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 2-8. ISBN 078039853X

electronic products

Bailey, C. ORCID: 0000-0002-9438-3879 , Warner, M., Agha, A., Pericleous, K. ORCID: 0000-0002-7426-9999 , Parry, J., Marooney, C., Reeves, H. and Clark, I. (2002) Flo/Stress: an integrated software module to predict stress in electronic products. Computing and Control Engineering Journal, 13 (3). pp. 143-148. ISSN 0956-3385 (doi:https://doi.org/10.1049/ccej:20020306)

electronics manufacturing

electronics packaging

electroplating

electrostatic

Li, H., Yu, W., Zhang, L., Liu, Z., Brown, K.E., Abraham, E., Cargill, S., Tonry, C., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 and Desmulliez, M.P.Y. (2013) Simulation and modelling of sub-30 nm polymeric channels fabricated by electrostatic induced lithography. RSC Advances, 3 (29). pp. 11839-11845. ISSN 2046-2069 (doi:https://doi.org/10.1039/c3ra40188j)

EM simulations

embedded die

encapsulant

encapsulant curing

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:https://doi.org/10.1109/ESIME.2008.4525086)

encapsulant material

encapsulants

encapsulation

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: 0000-0001-8307-6403 , Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:https://doi.org/10.1109/TCPMT.2011.2177524)

energy management

engineering computing

environmental factors

environmental management

estimate of cure

evaluation

event history analysis

failure

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2009) Lifetime prediction of an IGBT power electronics module under cyclic temperature loading conditions. In: Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ USA, pp. 274-279. ISBN 9781424446582 (print), 9781424446599 (doi:https://doi.org/10.1109/ICEPT.2009.5270749)

failure analysis

fatigue

Bailey, C. ORCID: 0000-0002-9438-3879 , Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical modelling of high power lateral IGBT for LED driver applications. In: IEEE Electronic Components and Technology Conference (ECTC). IEEE Electronics Packaging Society (formerly CPMT), pp. 1375-1381. ISBN 978-1-5386-5000-4 ISSN 2377-5726 (Online) (doi:https://doi.org/10.1109/ECTC.2018.00210)

fatigue life-time

fatigue of materials

FEA

ferrous operations

fibre optic hydrophone

filled polymers

films (states of matter)

fine-pitch technology

finite difference time-domain analysis

finite element

Fallah, N.A., Bailey, C. ORCID: 0000-0002-9438-3879 , Cross, M. and Taylor, G.A. (2000) Comparison of finite element and finite volume methods application in geometrically nonlinear stress analysis. Applied Mathematical Modelling, 24 (7). pp. 439-455. ISSN 0307-904X (doi:https://doi.org/10.1016/S0307-904X(99)00047-5)

Finite element analysis

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.12.002)

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2003) Optimization and finite element analysis for reliable electronic packaging. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-399. ISBN 0780370546

Finite Element Analysis (FEA)

finite element analysis methods

finite element method

finite element modeling

finite element modelling

Berthou, M., Lu, H. ORCID: 0000-0002-4392-6562 , Retailleau, P., Frémont, H., Guédon-Gracia, A., Davennel, C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques. In: 2010 IEEE CPMT Symposium Japan, ICSJ10. IEEE Computer Society, Piscataway, USA, pp. 1-4. ISBN 9781424475933 (doi:https://doi.org/10.1109/CPMTSYMPJ.2010.5679536)

finite volume

Slone, A.K., Pericleous, K. ORCID: 0000-0002-7426-9999 , Bailey, C. ORCID: 0000-0002-9438-3879 , Cross, M. and Bennett, C. (2004) A finite volume unstructured mesh approach to dynamic fluid–structure interaction: an assessment of the challenge of predicting the onset of flutter. Applied Mathematical Modelling, 28 (2). pp. 211-239. ISSN 0307-904X (doi:https://doi.org/10.1016/S0307-904X(03)00142-2)

Slone, A.K., Pericleous, K. ORCID: 0000-0002-7426-9999 , Bailey, C. ORCID: 0000-0002-9438-3879 , Cross, M. and Bennett, C. (2003) A finite volume unstructured mesh approach to dynamic fluid–structure interaction: an assessment of the challenge of predicting the onset of flutter. Applied Mathematical Modelling, 28 (2). pp. 211-239. ISSN 0307-904X (doi:https://doi.org/10.1016/S0307-904X(03)00142-2)

Slone, A.K., Pericleous, K. ORCID: 0000-0002-7426-9999 , Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2002) Dynamic fluid–structure interaction using finite volume unstructured mesh procedures. Computers and Structures, 80 (5-6). pp. 371-390. ISSN 0045-7949 (doi:https://doi.org/10.1016/S0045-7949(01)00177-8)

Slone, A.K., Pericleous, K. ORCID: 0000-0002-7426-9999 , Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2001) Dynamic fluid-structure interaction using finite volume unstructured mesh procedures. In: European Conference on Computational Fluid Dynamics ECCOMAS CFD 2006 Proceedings. ECCOMAS. ISBN 0905091124

Slone, A.K., Cross, M., Pericleous, K.A. ORCID: 0000-0002-7426-9999 and Bailey, C. ORCID: 0000-0002-9438-3879 (2001) A finite volume unstructured mesh approach to dynamic fluid-structure interaction: an assessment of the challenge of flutter analysis. In: Trends in Computational Structural Mechanics. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain, pp. 741-750. ISBN 8489925771

finite volume method

finite volume methods

finite volume unstructured mesh

finite volumes

finite-volume code

five process parameters

Flex-No-Lead project

Rizvi, M.J., Yin, C.Y ORCID: 0000-0003-0298-0420 , Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, H. ORCID: 0000-0002-4392-6562 (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

flexible circuit board

flexible-substrates

flip chip

Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2002) Optimisation modelling for flip-chip solder joint reliability. Soldering and Surface Mount Technology, 14 (1). pp. 49-58. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910210416477)

flip chip devices

flip chip on flex

flip chip packaging

flip-chip

flip-chip assembly

Lu, H. ORCID: 0000-0002-4392-6562 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 , Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

flip-chip devices

flip-chip devices printed circuit manufacture

flip-chip packaging

flipchip

flow

flow simulation

fluid flow

fluid structure interaction

Fluids

fluids engineering descriptors

fluid–structure interaction

flux

focused ion beam

Tang, Y.K., Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2008) Optimisation methodology for risk mitigation in advanced micro-system electronics manufacturing. In: EngOpt 2008 - International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7

Focused Ion Beam (FIB) method

forced convection

forging processes

Fourier transform infra-red spectroscopy (FTIR)

Garofalo equation

Rizvi, M.J., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Bevan, E., Poutney, N. and Coates, J. (2010) Finite element modelling of failures in thick film chip resistor solder joints. In: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010. in: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International Issue Date: 20-22 Oct. 2010 . IEEE Xplore Digital Library, Taipei, pp. 1-4. ISBN 978-1-4244-9785-0 (electronic), 978-1-4244-9783-6 (print) ISSN 2150-5934 (doi:https://doi.org/10.1109/IMPACT.2010.5699488)

gas flow

Generative manufacturing

geometric conservation law

geometrically nonlinear

geometry

glass transition temperature

granular flows

Graphics processing units

heat conduction

heat transfer

heating

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T. ORCID: 0000-0001-8307-6403 , Bailey, C. ORCID: 0000-0002-9438-3879 and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:https://doi.org/10.1109/TMTT.2008.2005925)

heatsink

heterogeneous electronics based systems

high aspect ratio microvia

high aspect ratio microvias

high performance

High Performance Primitive Collections

McManus, K., Cross, M., Walshaw, C. ORCID: 0000-0003-0253-7779 , Johnson, S., Bailey, C. ORCID: 0000-0002-9438-3879 , Pericleous, K. ORCID: 0000-0002-7426-9999 , Slone, A. and Chow, P. (2000) Virtual manufacturing and design in the real world - implementation and scalability on HPPC systems. In: Parallel Computational Fluid Dynamics 1999: Towards Teraflops, Optimization and Novel Formulations. North-Holland, Amsterdam, The Netherlands, pp. 47-56. ISBN 978044482851 (doi:https://doi.org/10.1016/B978-044482851-4.50009-8)

high-aspect ratio microfabrication

higher-density interconnection

historic

hollow microstucture

HPPC

human vision models

industrial plants

instabilities

insulated gate bipolar transistors

integrated circuit

integrated circuit interconnections

integrated circuit modelling

integrated circuit packaging

integrated circuit reliability

Integrated Design of Experiments (DoE)

integrated optoelectronics

integrated software module

integration

interconnection technology

interconnections

interfaces (computer)

interfaces (materials)

intermetallic compounds

isotropic conductive adhesive materials

junction temperatures

just-noticeable difference

Kernel

key design parameters

key parameters

laser

Gwyer, D., Bailey, C. ORCID: 0000-0002-9438-3879 , Pericleous, K. ORCID: 0000-0002-7426-9999 , Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012447)

laser beam welding

Lateral IGBT

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.02.024)

LCD

LCD displays

lead free solder interconnects

lead-free soldering

lead-free solders

Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2010.07.152)

LED

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC). THERMINIC, pp. 1-5.

LED backlighting devices

LED displays

LED driver

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Ortiz-Gonzalez, J. and Alatise, O. (2016) Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics. In: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-4673-9706-3 (doi:https://doi.org/10.1109/THERMINIC.2015.7389607)

LED drivers

LEDs

level set method

life testing

LIGBT

light emitting diodes

light emitting diodes (LEDs)

Yek, Bing Lee, Strusevich, N., Bailey, C. ORCID: 0000-0002-9438-3879 , Chun-Yan, Yin and Cartwright, C. (2009) Packaging of light emitting diodes for display backlights: Need for multi-disciplinary design tools. In: Electronic Packaging Technology & High Density Packaging, 2009. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 205-208. ISBN 978-1-4244-4659-9 (online), 978-1-4244-4658-2 (print) (doi:https://doi.org/10.1109/ICEPT.2009.5270764)

load-induced thermal cycling

Musallam, M., Johnson, C.M., Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2009) Real-time comparison of power module failure modes under in-service conditions. In: 2009 13th European Conference on Power Electronics and Applications, EPE '09. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-10. ISBN 978-90-75815-13-9 (electronic), 978-1-4244-4432-8 (print)

loss modulus

luminance

machine learning

magnetic fields

manufacturing technicians

Marangoni flow

Wheeler, D., Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2000) Numerical modelling and validation of Marangoni and surface tension phenomena using the finite volume method. International Journal for Numerical Methods in Fluids, 32 (8). pp. 1021-1047. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:https://doi.org/10.1002/(SICI)1097-0363(20000430)32:8<1021::AID-FLD998>3.0.CO;2-1)

material deformation

Materials

materials processing

materials properties

materials science

Materials scientist

mathematics

Bailey, C. ORCID: 0000-0002-9438-3879 , Clapham, S., Cross, M., Dixon, T., Wolfe, S. and Norman, P. (1996) Modelling stress evolution during cable fabrication. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 97-100. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:https://doi.org/10.1002/zamm.19960761408)

matrix

Maxwell equations

mechanical

Mechanical engineering

mechanical loading

mechanics

megasonic agitation

metal migration

metals casting

Bailey, C. ORCID: 0000-0002-9438-3879 , Chow, P., Cross, M., Fryer, Y. and Pericleous, K. ORCID: 0000-0002-7426-9999 (1996) Multiphysics modelling of the metals casting process. Proceedings of the Royal Society A, 452 (1946). pp. 459-486. ISSN Online: 1471-2946 (doi:https://doi.org/10.1098/rspa.1996.0024)

metals extrusion

metals processing

methodology

micro and nano system

micro-machining process

micro-particle imaging velocimetry (micro-PIV)

microassembling

microelectronic processing

Microelectronics

microelectronics manufacturing

microelectronics packaging

microfabrication

Microfluidics

microwave

microwave cure

microwave curing

microwave curing system

Adamietz, R., Müller, G., Othman, N., Eicher, F., Tilford, T. ORCID: 0000-0001-8307-6403 , Ferenets, M., Pavuluri, S.K., Desmulliez, M. P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) On the integration of microwave curing systems into microelectronics assembly processes. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642827)

microwave devices

microwave energy

microwave heating

microwave measurements

microwave oven

microwave ovens

microwave processing

microwave theory and techniques

Miner's law of linear damage accumulation

miniaturisation

miniaturized consumer electronic products

model implementation

Wheeler, D., Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (1998) A computational modelling framework to predict macroscopic phenomena in solder joint formation. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 212 (2). pp. 141-157. ISSN 0954-4054 (Print), 2041-2975 (Online) (doi:https://doi.org/10.1243/0954405981515563)

modeling

modeling iron

modelling

modelling polymerisation

modelling techniques

Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Modelling techniques used to assess conductive adhesive properties. In: Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 , (eds.) Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

modules

moisture absorption

Monte Carlo simulation

multi-disciplinary analysis

multi-disciplinary design

Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Tilford, T. ORCID: 0000-0001-8307-6403 , Rizvi, J. and Yin, C. ORCID: 0000-0003-0298-0420 (2009) Co-design and multi-physics analysis for power electronic modules. In: 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. IEEE Computer Society, Piscataway, NJ USA. ISBN 9781424441600 (doi:https://doi.org/10.1109/ESIME.2009.4938505)

multi-physics

Multi-physics modeling

multi-physics modelling

multi-physics processes

multi-scale computational simulations

multiphase flow

multiphysics analysis

multiphysics modeling

multiphysics modelling

nanopatterning

natural convection

new two-layer hybrid kE/ki model

Newmark algorithm

nitrogen

no-flow underfill materials

non-Newtonian

Numerical Analysis

numerical modeling

numerical modelling

Numerical models

Numerical Optimilation

numerical optimisation

numerical optimization material properties

numerical simulation

Oldroyd-B

open-ended microwave oven

open-ended waveguide cavity oven

optical and thermal modelling techniques

optical backplanes

optical backplanes optical planar waveguides

optical behaviour

optical couplers

optical performance

optical simulation

optical waveguides photodiodes

optimal design

optimisation

optimisations

optimization

optoelectronic packages

organic light emitting diodes

ovens

oxygen

packaging

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: 0000-0001-8307-6403 , Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:https://doi.org/10.1109/TCPMT.2011.2177524)

parallel computer systems

particle swarm optimisation algorithm

particle swarm optimisation method

particle swarm optimization

performance data

PHM

PHYSICA

physics of failure (PoF)

Physics-of-failure (PoF) model

pigtail fibre optic

plastic deformation

polymer crosslinking

polymer cure kinetics models

polymer cure models

polymer films

polymer solutions

polymeric channels

post weld stresses

power bipolar transistors

Power electronic module

Power Electronic Module (PEM)

Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Yin, C. ORCID: 0000-0003-0298-0420 and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

power electronics

power electronics modules (PEMs)

power integrated circuits

power modules

power system management

power system modeling

predictive reliability

printed circuit board (PCB)

printed circuit boards

printing

probabilities

Product developers

product functionality

Production technicians

Production technology

prognostic and health management (PHM)systems

prognostics framework

prognostics health management

quadratic response

qualification testing

quality

quantum mechanics (e.g.

radio frequency (RF) curing

ray tracing calculations

real-time health management

real-time thermal models

recirculation vortex

recirculation vortices

Reduced Order Models (ROM)

refinishing

reflow

reflow soldering

reinforcement method

reinforcement technique

reliability

reliability prediction

reliability targets

reliable electronic packaging

Religious work

renewable energy

resonant cavity

resonant microwave applicator

Response Surface

response surface methodology

Reynolds number

rheology

Durairaj, R., Jackson, G.J., Ekere, N.N., Glinski, G. and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Correlation of solder paste rheology with computational simulations of the stencil printing process. Soldering and Surface Mount Technology, 14 (1). pp. 11-17. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910210416422)

risk assessment

ruggedized electronic display

SAC alloy

scanning acoustic microscopes

second level

semiconductor device

semiconductor device modeling

semiconductor device packaging

semiconductor device reliability

semiconductor lasers

semiconductor process modelling

Sensitivity analysis

ship

side-by-side dies

silicon

simulation technique

simulation tools

SiP technology

Sn-2.8Ag-0.5Cu-1.0Bi

SnPb and SnAgCu (solder alloys)

social support

software

solder balls

solder degradation

solder joint

solder joints

Solder material

solder paste

solder pastes

soldered joints

soldering

solders

solders thermal stress cracking

solid mechanics

solid state lighting

solid state lighting systems

solidification

stacked die

steelmaking processes

stencil printing

stencils

storage modulus

stoves

strength of materials

stress

structure

surface

surface emitting lasers

surface mount packages

surface mount technology

Surface tension

Surrogate models

SWCNT (single walled carbon nanotube)-Cu composites

task identity

task performance

task variety

technology management

temperature

temperature distribution

temperature measurement

tension

the density functional method)

the finite element method)

thermal

thermal analysis

thermal cycling

thermal expansion

thermal management

thermal management (packaging)

thermal management of electronics

thermal stresses

thermo-mechanical loading

thermo-mechanical reliability analysis

thermomechanical stress development

Thermomigration

thermosetting polymer

thick film chip resistors

Thin film

through-hole packages

time to failure

Topological Optimisation

Santhakrishnan, M., Tilford, T. ORCID: 0000-0001-8307-6403 and Bailey, C. ORCID: 0000-0002-9438-3879 (2016) On the Application of Topology Optimisation Techniques to Thermal Management of Microelectronics Systems. In: IEEE EuroSimE conference, 17-20 April, 2016, Montpellier, France.

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